The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC's CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In response, NVIDIA has enlisted the help o...

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

Apple's product line is rumored to set for a significant upgrade. According to a report from Economic Daily News, the next-generation M4 and A18 processors, slated for iPads, MacBooks, and iPhones, are expected to increase the number of built-in AI computing cores, leading to a substantial growth ...

In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...

TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain. In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due to the expansion of end-user applications such as PCs and mobile pho...