CoWoS


2023-09-25

[News] TSMC Deploys Manpower to Support Longtan and Tainan Facilities Amid CoWoS and 3nm Demand

According to Taiwan's Money DJ, the AI wave is showing no signs of slowing down. Led by NVIDIA, major players including AMD, Intel, and international chip giants are aggressively entering the AI arena, driving increasing demand for advanced packaging and advanced processes. Industry reports suggest ...

2023-09-25

[News] UMC and ASE Weigh Price Increases in Booming Advanced Packaging Market

According to a report by Taiwan's Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply chain, such as UMC and ASE G...

2023-09-25

[News] TSMC’s Advanced Packaging Sees Surge with Rush Orders from NVIDIA, AMD, Amazon

According to a report by Taiwan's Economic Daily, TSMC's CoWoS advanced packaging capacity is running at full throttle. As they actively expand their production capabilities, there are reports of major customers like NVIDIA increasing their orders for AI chips. Additionally, industry giants like AMD...

2023-09-12

[News] Facing CoWoS Shortage, TSMC’s Taichung Plant Joins Capacity Support

According to a report by Taiwan's Commercial Times, TSMC is facing a tight supply of advanced packaging capacity, with its Taichung factory ramping up equipment support at a rapid pace. Industry insiders have disclosed that TSMC's annual production capacity for the backend CoWoS (Chip-on-Wafer-on-Su...

2023-09-07

[News] CoWoS Production Shortage, TSMC Expects Capacity Will Catch Up in 1.5 Years

According to Taiwan's Economic Daily, TSMC Chairman Mark Liu stated on 9/6 that semiconductor technology development "has reached the exit of the tunnel, and there are more possibilities beyond the tunnel; we are no longer bound by the tunnel." Regarding TSMC's progress in establishing a factory ...

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