Subject


CoWoS


2024-02-21

[News] Pioneering an AI Era: Assessing the Prosperity and Challenges of the NVIDIA

Last year's AI boom propelled NVIDIA into the spotlight, yet the company finds itself at a challenging crossroads. According to a report from TechNews, on one hand, NVIDIA dominates in high-performance computing and artificial intelligence, continuously expanding with its latest GPU products. On ...

2024-02-19

[News] TSMC Reportedly Doubles CoWoS Capacity while Amkor, ASE also Enter Advanced Packaging for AI

The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC's CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In response, NVIDIA has enlisted the help o...

2024-02-19

[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

2024-02-15

[News] Apple Reportedly Places Large Orders for TSMC’s 3nm While Simultaneously Securing Significant Advanced Packaging Capacity

Apple's product line is rumored to set for a significant upgrade. According to a report from Economic Daily News, the next-generation M4 and A18 processors, slated for iPads, MacBooks, and iPhones, are expected to increase the number of built-in AI computing cores, leading to a substantial growth ...

2024-01-18

[News] TSMC’s SoIC Demand Heats Up, Reports Suggest Significant Capacity Expansion

In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...

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