CoWoS


2023-08-16

[News] CoWoS Production Surges at TSMC, UMC, Amkor, and ASE Hasten to Catch Up

According to a report by Taiwan's Commercial Times, JPMorgan's latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC's CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected to reach 28,000 to 30,000...

2023-08-11

Intel and Samsung Join TSMC in Fierce Advanced Packaging Race

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a n...

2023-08-09

AI GPU Bottleneck Explained: Causes and Prospects for Resolution

Charlie Boyle, Vice President of NVIDIA's DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing Company's (TSMC) wafer produ...

2023-08-08

An In-Depth Explanation of Advanced Packaging Technology: CoWoS

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence ...

2023-07-31

High-Tech PCB Manufacturers Poised to Gain from Remarkable Increase in AI Server PCB Revenue

Looking at the impact of AI server development on the PCB industry, mainstream AI servers, compared to general servers, incorporate 4 to 8 GPUs. Due to the need for high-frequency and high-speed data transmission, the number of PCB layers increases, and there's an upgrade in the adoption of CCL grad...

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