According to a report from Commercial Times citing sources, it's revealed that NVIDIA has executed changes to the Blackwell series' 6-layer GPU mask. Therefore, the process can now proceed without re-taping out, as production delays being minimized. The report noted that NVIDIA's updated ...

Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry. Given the broader applicability of 12-inch wafer in ...

Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips. According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, T...

With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...

Amid the AI boom driving a surge in demand for advanced packaging, Samsung Electronics announced in March its ambition to achieve record-high revenue for the business this year, aiming to surpass the USD 100 million mark. The company, which is eager to catch up with TSMC not only on the foundry bu...