According to sources cited in a report from Commercial Times, in response to the global increase in chip orders and rapid AI development, TSMC is actively seeking available land to keep its most advanced process technologies in Taiwan. Currently, TSMC has already planned three 2nm fabs at the N...

According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...

Despite recent issues with NVIDIA's GB200 shipments, the market remains optimistic about long-term AI demand, and CoWoS capacity continues to be in short supply. According to a report from MoneyDJ, TSMC will assign orders of the initial stage of chip stacking in CoWoS packaging, Chip on Wafer (Co...

According to a report from Commercial Times, despite ongoing turbulence in the semiconductor industry, including Intel's capital expenditure cuts and reported bottlenecks in NVIDIA's B-series GPU, TSMC's leading position in the industry may remain unshaken. The sources cited in the report note...

As the demand for AI GPUs increases, TSMC's advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same report, TS...