As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced packaging and HBM (High Bandwidth Memory) technology, which is expected to benefit the silicon wafer industry. Recently, Doris Hsu, the Chairperso...

TSMC's advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has stated that TSMC intends to build another advanced pack...

Taiwan's semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity. According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise ...

With high demand for AI chips from major players like NVIDIA and AMD, the capacity for advanced packaging falls short of meeting demand. Industry sources cited in a report from the Economic Daily News indicate that TSMC's new CoWoS facility in the Southern Taiwan Science Park in Chiayi is now underg...

At TSMC’s 2024 Technology Symposium in late May, Kevin Zhang, TSMC Senior Vice President of Business Development, has shared the company’s latest development on advanced packaging. This article recaps the highlights in the forum, featuring TSMC's breakthroughs regarding advanced packaging. ...