The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging. Southern Taiwan Science Park, Central Taiwan Sci...

In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean media outlet TheElec. Citing anonymou...

NVIDIA's upcoming next-generation high-end AI chip, the H200, is on the horizon. As per a report from Economic Daily News, currently, the mainstream high-end H100 chip has seen a decline in demand, putting an end to the previous state of supply shortages. As per the same report, Taiwanese contra...

TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanoshe...

Amid NVIDIA's leadership in the AI wave, demand for CoWoS (Chip-on-Wafer-on-Substrate) has tripled, driving TSMC to aggressively expand CoWoS capacity, with a corresponding surge in demand for System-in-Integrated-Circuit (SoIC) solutions. According to a report from MoneyDJ citing industry source...