At TSMC’s 2024 Technology Symposium in late May, Kevin Zhang, TSMC Senior Vice President of Business Development, has shared the company’s latest development on advanced packaging. This article recaps the highlights in the forum, featuring TSMC's breakthroughs regarding advanced packaging. ...

According to a report from TechNews, TSMC held a technology forum on May 23, where Senior Fab Director pointed out that benefiting from HPC and mobile phone demands, the 3nm production capacity this year has more than tripled compared to last year, but this is actually still not enough, so efforts a...

The world's four major CSPs (Cloud Service Providers) – Microsoft, Google, Amazon, and META – are continuously expanding their AI infrastructure, with their combined capital expenditures projected to reach USD 170 billion this year. According to the industry sources cited in a report from Commer...

With the skyrocketing demand for AI, cloud service providers (CSPs) are hastening the development of in-house chips. Apple, making a surprising move, is actively developing a data center-grade chip codenamed "Project ACDC," signaling its foray into the realm of AI accelerators for servers. As per...

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...