According to a report from Commercial Times, sources indicate that due to U.S. restrictions on AI computing power exports to China, the application for an ADAS (Advanced Driver Assistance System) chip by Taiwanese ASIC manufacturer Alchip was rejected. The ADAS chip developed by Li Auto, named "S...

NVIDIA’s GB200 thermal challenges have made Co-Packaged Optics (CPO) technology a key topic in the tech industry. According to Commercial Times, NVIDIA plans to unveil a new CPO-based switch at the March GPU Technology Conference (GTC), with mass production slated for August. Suppliers like TSMC a...

According to a report by the Economic Daily News, TSMC has made significant progress in its silicon photonics strategy. The company recently achieved the integration of co-packaged optics (CPO) with advanced semiconductor packaging technologies, with sample deliveries expected to commence in early 2...

According to a report from Taiwan's Commercial Times, industry experts assert that Silicon Photonics (SiPh) is poised to revolutionize the cloud industry as communication transmission speeds surge beyond 1.6 Tbps. Utilizing Co-Packaged Optics (CPO) for integration, SiPh combines optical components a...

ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE's progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing...