TSMC is set to offer a new round of its CyberShuttle prototyping service in September. According to sources cited in a report from Commercial Times, it’s revealed that, as per usual practice, there are two opportunities each year, in March and September, for customers to submit their projects. It is indicated that the highlight this time is expected to be the 2nm process, providing leading companies with an opportunity to gain an edge.

TSMC’s 2nm technology is progressing smoothly, with the new Hsinchu Baoshan plant on track for mass production next year. Previously, there were rumors indicating that Apple is considering adopting 2nm chips in 2025, with the iPhone 17 series potentially being among the first devices to use them.

Reportedly, both TSMC’s N2P and A16 technologies are expected to enter mass production in the second half of 2026, offering improvements in power efficiency and chip density.

ASIC companies are eagerly participating in CyberShuttle this time, even though customer intentions for the first 2nm tape-out are still unconfirmed. However, this technology will likely maintain TSMC’s leadership in advanced processes, securing its future technological advantage.

CyberShuttle, also known as MPW (Multi-Project Wafer), refers to the process of placing chips from different customers onto the same test wafer. This approach not only allows for the shared cost of photomasks but also enables rapid chip prototyping and verification, enhancing customers’ cost efficiency and operational effectiveness.

Based on TSMC’s official information, the CyberShuttle prototyping service significantly reduces NRE costs by covering the widest technology range (from 0.5um to 7nm) and the most frequent launch schedule (up to 10 shuttles per month), all through the Foundry segment’s most convenient on-line registration system.)

TSMC’s CyberShuttle prototyping service also validate the sub-circuit functionality and process compatibility of IP, standard cell libraries and I/Os, reducing prototype costs by up to 90%. TSMC states that their current CyberShuttle service covers the broadest range of technologies and can offer up to 10 shuttles per month.

TSMC’s 2nm technology is expected to make its debut in September, offering opportunities for test chips.

Per the report from Commercial Times, IC design companies have pointed out that, unlike the familiar FinFET (Fin Field-Effect Transistor) structure, the industry is transitioning to the Gate-All-Around FET (GAAFET) structure, making it crucial for the market to quickly adapt.

This also allows IC design companies to provide related products to end customers, demonstrating their 2nm design capabilities.

ASIC companies have also revealed that, based on CyberShuttle data, the number of advanced process projects below 7nm is relatively small, with mature processes still dominating.

This suggests that future competition will likely focus on a few leading companies. Those who miss the first wave of 2nm technology may fall behind their competitors by up to six months, making securing a spot on the Shuttle even more critical.

Read more

• [News] TSMC Reportedly to Raise 3nm & 5nm Prices Soon, Looking to Maintain Long-Term Profit Margins 
• [News] Apple Not Adopting TSMC 2nm for iPhone 17? A19 Pro Chip Rumored to Use N3P Process

(Photo credit: TSMC)