According to a report from Ijiwei, a China-based media, industry insiders have revealed that Taiwanese display driver IC (DDI) suppliers are considering shifting their chip manufacturing to China due to cost considerations, as the prices offered by chip foundries there are significantly lower than those in Taiwan.

Almost all DDI suppliers are feeling substantial pressure to reduce the prices of display driver chips in the latter half of 2023. Industry sources state that while the touch and display driver integration (TDDI) chips for smartphone screens have nearly reached cost parity, the prolonged slump in the smartphone market has led display panel customers to shift the pressure upstream along the supply chain.

The downward pricing pressure on display driver chips isn’t confined to the smartphone sector alone. Medium and large panel customers in segments like TVs and automotive displays are also requesting more substantial discounts from DDI manufacturers. However, the pressure from these sectors is somewhat less pronounced than that from the smartphone sector.

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Thanks to the increased adoption of AMOLED panels by major smartphone brands including Apple and Samsung, the penetration rate of AMOLED panels in the smartphone market is expected to reach 39.8% in 2021 and 45% in 2022, according to TrendForce’s latest investigations. As AMOLED panels see increased adoption, the consumption of AMOLED DDI will undergo a corresponding increase as well. However, not only are the process technologies used for AMOLED DDI manufacturing currently in short supply, but some foundries are also yet to finalize their schedules for expanding their AMOLED DDI production capacities. Given the lack of sufficient production capacity, the increase in AMOLED panel shipment may potentially be constrained next year.

Regarding process technologies, the physical dimension of AMOLED DDI chips is generally larger compared to other chips, meaning each wafer yields relatively fewer AMOLED DDI chips, and more wafer inputs are therefore needed for their production. The vast majority of AMOLED DDI is currently manufactured with the 40nm and 28nm medium-voltage (8V) process technologies. In particular, as 40nm capacity across the foundry industry is in tighter supply compared to 28nm capacity, and TSMC, Samsung, UMC, and GlobalFoundries are the only foundries capable of mass producing AMOLED DDI, an increasing number of new wafer starts for AMOLED DDI are being migrated to the 28nm node instead.

Regarding wafer supply, the foundry industry is currently unable to fulfill client demand for 12-inch wafers. Hence, 12-inch capacities allocated to AMOLED DDI production are relatively limited as well. At the moment, only TSMC, Samsung, and UMC are able to allocate relatively adequate wafer capacities, although their capacity expansion efforts are still falling short of growing market demand. In addition, while SMIC, HLMC, and Nexchip are developing their respective AMOLED DDI process technologies, they have yet to confirm any mass production schedules. TrendForce therefore expects that the additional AMOLED DDI capacities to be installed next year will remain scarce, in turn further limiting the potential growth of the AMOLED panel market.

AMOLED DDI suppliers must overcome the issues of limited production capacity and technological difficulties in R&D

Other than the issue of tight production capacities, the difficulty of AMOLED DDI development is further compounded by the fact that each panel manufacturer has its unique specifications of AMOLED panels. For instance, panel manufacturers differ in terms of their display image uniformity (including the calibration of on-screen picture quality via eliminating display clouding, poor color/brightness compensation, and sandy mura). Hence, in order to address the discrepancies among panels manufactured by different companies, IC suppliers must adopt different compensating solutions and account for different parameters. Panel manufacturers therefore are likelier to adopt DDI from IC suppliers whose solutions have already been in mass production.

If prospective IC suppliers were to enter the AMOLED DDI market, they would need to overcome various difficulties in AMOLED DDI development, including long processes of validation and revision, in order to mass produce at scale. As well, each individual panel supplier requires its own different set of IP cores (referring to the various functional modules in an IC) and specifications, making it difficult to manufacture AMOLED DDI that is universally compatible with all AMOLED panels. For instance, ICs that are supplied to Korean panel manufacturers by AMOLED DDI suppliers are incompatible with AMOLED panels from Chinese panel manufacturers, which require new wafer starts with their own requirements.

On the whole, other than certain DDI suppliers which have their own subsidiary foundries or have longstanding foundry partners capable of DDI production, TrendForce believes that fabless AMOLED DDI suppliers must not only secure a stable and sufficient source of foundry capacity, but also possess sufficient technological competency for mass production, in order to successfully expand their presence in the AMOLED DDI market.

For more information on reports and market data from TrendForce’s Department of Display Research, please click here, or email Ms. Vivie Liu from the Sales Department at vivieliu@trendforce.com

The stay-at-home economy generated by the COVID-19 pandemic has galvanized a rising demand for IT products this year, with a corresponding increase in DDI demand as well, according to TrendForce’s latest investigations. More specifically, large-sized DDI demand is expected to increase by as much as 7.4% YoY in 2021, although the availability of 8-inch foundry capacity in the upstream supply chain is expected to increase by a mere 2.5% YoY due to other chips with relatively higher margins occupying much of this capacity. Foundries such as NexChip and SMIC are still continuing to install production capacities this year, and the supply of large-sized DDI will undergo a slight increase as a result. However, these newly installed capacities will be unable to fully alleviate the scarcity of large-sized DDI, which may potentially persist until the end of 2021.

While the supply of TCON similarly faces the issue of shortage, high-end TCON models bear the brunt of the impact

In addition to the tight supply of large-sized DDI, the recent shortage of TCON (timing controllers) has also adversely affected the shipment volume of large-sized panels, especially for high-end TCON models. The shortage of TCON can primarily be attributed to the fact that high-end TCON is mainly manufactured in 12-inch fabs, where various chips compete over limited wafer capacities. In addition, backend logic IC packaging and testing capacities are similarly in short supply, thereby adding further risk to the supply of TCON. In particular, manufacturing high-end TCON requires longer wire bonding time compared with mainstream TCON, meaning the current shortage of wire bonding capacity will lead to a widening shortage of high-end TCON. While the expanding capacity of packaging and testing services for logic chips is yet to catch up to the surging demand for various end products, the shortage of high-end TCON will unlikely be alleviated in the short run.

Prices of large-sized DDI will undergo an increase once again in 3Q21 due to persistently tight supply

TrendForce’s investigations indicate that, as 8-inch foundry capacities fall short of market demand, production capacities allocated to large-sized DDI have accordingly been crowded out by other chips. Foundry quotes are also expected to undergo an increase once again in 3Q21. Hence, IC suppliers will accordingly raise their large-sized DDI quotes for clients in the panel manufacturing industry as well. It should be pointed out that the demand for IT products is expected to slow down in response to increased vaccinations in Europe and the US, where governments have been gradually easing lockdown measures and border restrictions. Therefore, demand for panels, which has remained in an upward trajectory since last year, will likely experience a gradual downward correction in 4Q21, thus narrowing the gap between supply and demand of large-sized DDI. However, IC suppliers will not be able to address the tight supply of backend packaging and testing capacity in the short run, so panel suppliers will still need to contend with a shortage of TCON going forward.

On the whole, IC suppliers are unlikely to obtain sufficient 8-inch foundry capacities for manufacturing large-sized DDI, since 8-inch fabs will continue to operate at maximum capacity utilization rates for the next year. IC suppliers must therefore flexibly adjust their large-sized DDI procurement in accordance with cyclical downturns of foundry demand. In other words, the supply and demand situation of large-sized DDI and TCON will remain key to the supply and demand of panels in 2022.

For more information on reports and market data from TrendForce’s Department o Display Research, please click here, or email Ms. Vivie Liu from the Sales Department at vivieliu@trendforce.com

Not only did automotive market take a downward turn starting in 2018, but the severe impact of the COVID-19 pandemic in 2020 also led to noticeably insufficient procurement activities from major automotive module suppliers, according to TrendForce’s latest investigations. However, as the automotive market is currently set to make a recovery, TrendForce expects yearly vehicle sales to increase from 77 million units in 2020 to 84 million units in 2021.

At the same time, the rising popularity of autonomous, connected, and electric vehicles is likely to lead to a massive consumption of various semiconductor components. Even so, since most manufacturers in the automotive supply chain currently possess a relatively low inventory, due to their sluggish procurement activities last year in light of weak demand, the discrepancies in the inventory levels of various automotive components, along with the resultant manufacturing bottleneck, have substantially impaired automakers’ capacity utilization rates and, subsequently, vehicle shipments.

The recent shortage situation in the IC supply chain has gradually extended from consumer electronics and ICT products to the industrial and automotive markets. In the past, manufacturers in the automotive semiconductor industry were primarily based on IDM or fab-lite business models, such as NXP, Infineon, STMicroelectronics, Renesas, ON Semiconductor, Broadcom, TI, etc. As automotive ICs generally operate in wide temperature and high voltage circumstances, have relatively long product lifecycle, and place a heavy demand on reliability as well as longevity support, it is more difficult for the industry to alternatively transition its production lines and supply chains elsewhere.

Automotive semiconductor remains in shortage as production capacities remain fully loaded across the global foundry industry

Nevertheless, given the current shortage of production capacities across the foundry industry, wafer capacities allocated to automotive semiconductor components have been noticeably crowded out by other products. Some of these examples include automotive MCU and CIS manufactured in 12-inch fabs, as well as MEMS, Discrete, PMIC, and DDI products manufactured in 8-inch fabs. TrendForce indicates that automotive semiconductor products manufactured at the 28nm, 45nm, and 65nm nodes in 12-inch fabs are suffering the most severe shortage at the moment, while production capacities at 0.18µm and above nodes in 8-inch fabs have also been in long queue by other products.

As in-house IDM fabrications have relatively high CAPEX, R&D expense, and operating overhead, automotive IC vendors have in recent years outsourced some of their products to TSMC, GlobalFoundries, UMC, Samsung, VIS, Win Semiconductor and so on. In particular, TSMC specifically indicated during its 4Q20 earnings conference that wafer starts for automotive semiconductors reached rock bottom in 3Q20, while additional orders began arriving in 4Q20. As such, the company is currently considering allocating some of its production capacities from logic ICs to specialty foundry, in order to meet sudden demand from its long-term customer relationship.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com