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    • Dimensity 7300

    News

    2024-05-30

    [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

    Consumer Electronics

    On May 30, MediaTek unveiled the Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both utilizing TSMC's highly efficient 4nm process. The Dimensity 7300 offers exceptional energy efficiency and performance, meeting the high demands for multitasking, imaging, gami...

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