According to a report from Commercial Times, IC design giant MediaTek is making its move into the AI accelerator sector. MediaTek CEO Rick Tsai emphasized that MediaTek aims to be the best partner for edge AI, focusing on advanced technologies and 3nm process to optimize the power consumption and efficiency of its SoCs (system-on-chips).

Tsai mentioned that MediaTek will unveil its Dimensity 9400 flagship series of chips in October, designed to perfectly support most large language models on the market. He expressed confidence in achieving a more than 50% year-over-year revenue increase for flagship devices.

For the ASIC (Application-Specific Integrated Circuit) market, MediaTek has confirmed its entry into the AI accelerator field and will integrate CPUs as needed. ASICs are expected to start the revenue contribution  in the second half of next year.

Additionally, the TAM (Total Addressable Market) for generative AI is still in its early stages. MediaTek focuses on providing leading interconnect capabilities, such as SerDes IP and Ethernet PHY.

Regarding AI technology in the smartphone sector, Rick Tsai believes that flagship smartphones are seeing an increase in ASP, and there is a gradual shift towards high-end smartphones in the Chinese market. He noted that Chinese brands are actively developing AI, particularly in model development, such as open-source models like LLaMA 3.

At MediaTek’s earnings call on July 31st, Rick Tsai noted that the company anticipates a return to normal seasonal patterns in the second half of the year. The outlook for the fourth quarter will largely depend on consumer product demand.

Regarding the outlook in the third quarter, MediaTek expects the revenue to be flattish, ranging from NTD 123.5 billion to NTD 132.4 billion, compared with NTD 127.27 billion last quarter. Gross margin is projected to slide to 45.5-48.5%, from 48.8%, down 3.6 percentage points quarter over quarter and up 1.3 percentage points year-over-year.

Aside from the boost expected from the Dimensity 9400 flagship release, the company’s fourth-quarter market demand is projected to be relatively moderate, which is why the annual outlook remains unchanged. MediaTek expects its full-year gross margin to be between 46% and 48%.

Regarding TSMC’s pricing adjustments, Rick Tsai remains unperturbed, noting that all industry peers face similar cost pressures. MediaTek aims to reflect cost increases through pricing, with a gross margin target of 47% for new products. Progress has also been made in 3nm and 2nm processes, and MediaTek has secured its capacity needs for 2025 with TSMC.

Moreover, MediaTek and NVIDIA are collaborating on automotive chips, with plans to launch their first chip in early 2025. Rick Tsai mentioned that details are yet to be disclosed, but significant advancements in the automotive sector are expected between 2027 and 2028.

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(Photo credit: MediaTek)

MediaTek and Xiaomi Group have deepened their collaboration. On July 2, Xiaomi China’s Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, announced on Weibo that the joint laboratory between Xiaomi and MediaTek has officially opened at Xiaomi’s Shenzhen R&D Center, with the new “Redmi K70 Supreme Edition” being the first product from the joint lab.

According to a report by etnet, the joint laboratory between Xiaomi and MediaTek covers five core capabilities, focusing on three major technological parts: performance, communication, and AI.

MediaTek, a global leader in smartphone chip shipment, maintains close cooperation with its brand clients.

Wang noted that following the Post-Performance Era Launch event last year, the cooperation between Xiaomi and MediaTek has reached another notch with a  goal of creating the strongest product performance experience and realizing the pre-research and implementation of the latest technologies.

A report from ithome revealed that Xiaomi and MediaTek have already entered into several collaborative agreements in the past, in which Xiaomi was often the first to launch new Dimensity processors. The two companies have also co-developed several Ultra versions of Dimensity processors.

Wang described the K70 Supreme Edition as the “performance demon” and the most sincere value-for-money product, offering a more comprehensive flagship experience. It is a gold standard for Dimensity performance jointly created by Redmi and MediaTek, aiming for three number ones: highest performance scores, best game frame rate/energy efficiency, and longest concurrent operation of super frame rate and super resolution.

Wang also mentioned that especially for the third goal, MediaTek, based on Dimensity 9300+ chip, has equipped the K70 Supreme Edition with the new-generation gaming discrete GPU and its self-developed dual-chip scheduling technology. “Not only to achieve super frame rate and super resolution in original/iron mode but also to realize the longest concurrent operation time, allowing users to enjoy games for longer periods.”

MediaTek Dimensity 9300+ is part of the Dimensity 9300 series of chips, launched in May this year. It is built using TSMC’s 4nm process and features an eight-core CPU with four Cortex-X4 super cores, reaching a maximum frequency of 3.4GHz, surpassing the level of Dimensity 9300.

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According to a report by the Korean media outlet The Chosun Daily on June 16th, Samsung’s “Galaxy Tab S10” series tablets will be equipped with MediaTek’s Dimensity 9300+ application processor (AP) from Taiwan, marking the first instance of MediaTek’s AP being adopted by Samsung’s flagship tablet.

The report highlights that MediaTek’s APs have primarily been used in Samsung’s mid-to-low-end smartphones. The decision to use MediaTek’s AP in the Galaxy Tab S10 series, instead of Qualcomm’s or Samsung’s own APs, is a significant shift for Samsung.

The sources cited in the report believe that Samsung’s move is a butterfly effect caused by TSMC’s price hikes. TSMC’s price increases have potentially led to a rise in the cost of Qualcomm’s Snapdragon chips, which are manufactured by TSMC. After price negotiations, Samsung’s Mobile Communications Business (MX) decided to equip the Snapdragon 8 Gen 3 chips only in the Galaxy Tab S10 Ultra series, while using MediaTek’s Dimensity chips in the Plus and base models.

The same report further indicates that from Samsung’s perspective, choosing Dimensity to reduce costs and diversify the supply chain is a sensible decision. However, for Samsung’s foundry division which manufactures Exynos, this development is somehow unwelcome. While Exynos used to have price advantages over Snapdragon in supplying Samsung’s flagship products, the use of Dimensity jeopardizes Exynos’ competitive edge in its bargaining power for future flagship product pricing negotiations.

Samsung Electronics’ upcoming AP, the “Exynos 2500,” set for release next year, will also face similar challenges. With TSMC recently rumored to increase price for its 3nm process, costs for Qualcomm’s Snapdragon 8 Gen 4, slated for release in October, are expected to sharply increase. Industry source cited by the report further suggests the cost of this chip could rise from over USD 200 in the previous generation to more than USD 250.

TSMC Chairman C.C. Wei recently stated that, almost all companies interested in AI-related demand are willing to work with TSMC. From the yield rates obtained by customers, TSMC offers the best cost-effectiveness solutions, hence there is room for price increases. Per a report from Liberty Times, the wafer order prices for TSMC in 2025 are expected to be finalized in September and October this year.

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• [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

(Photo credit: MediaTek)

On May 30, MediaTek unveiled the Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both utilizing TSMC’s highly efficient 4nm process. The Dimensity 7300 offers exceptional energy efficiency and performance, meeting the high demands for multitasking, imaging, gaming, and AI computing in terminal devices. The Dimensity 7300X supports dual-screen displays, making it suitable for foldable devices.

The Dimensity 7300 series features an octa-core CPU with 4X Arm Cortex-A78 cores operating at 2.5GHz paired with four Cortex-A55 cores. Compared to the Dimensity 7050, the advanced 4nm Cortex-A78 cores in the Dimensity 7300 can achieve up to 25% power savings at the same performance level.

The Dimensity 7300 is equipped with a 12-bit HDR-ISP image processor, Imagiq 950, which supports up to a 200MP main camera, enabling smartphone users to capture images with outstanding color and detail. The Dimensity 7300 combines a new hardware engine that provides precise noise reduction (MCNR), hardware face detection (HWFD), and video HDR capabilities, allowing users to capture clear images in various lighting conditions.

“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”

Compared to the Dimensity 7050, the Dimensity 7300 offers a 1.3 times improvement in live focus photo performance and a 1.5 times improvement in photo remastering. Additionally, the dynamic range for 4K HDR video recording has been enhanced by 50% compared to similar products, delivering richer image details. The Dimensity 7300 integrates the AI processor APU 655, which delivers performance that is twice that of the Dimensity 7050.

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(Photo credit: MediaTek)

On November 6, 2023, MediaTek unveiled its latest flagship smartphone SoC, the Dimensity 9300. Benchmark data reveals that the Dimensity 9300 outperforms Qualcomm’s flagship chips in both CPU (multi-core) and GPU performance.

However, Qualcomm enjoys a strong brand reputation and recognition in the consumer market, making it a challenging task for MediaTek to capture the top market position for high-end SoCs in the Android camp with this chip.

TrendForce’s Insights:

1. Brand New Design Boosts Dimensity 9300 Benchmark Performance

Diverging from the conventional “big core + small core” architecture, MediaTek introduces a groundbreaking “4+4” design in the Dimensity 9300. This chip comprises 4 Cortex-X4 cores (clocking up to 3.25GHz) and 4 Cortex-A720 cores (running at 2.0GHz).

According to MediaTek’s official data, this new architecture delivers a 40% increase in multi-core peak performance compared to the previous-generation Dimensity 9200. Additionally, it achieves a 33% reduction in power consumption while maintaining the same level of performance.

In addition to its outstanding chip performance and energy efficiency, the Dimensity 9300 achieves a significant breakthrough in the field of AI. According to official data, powered by the seventh-generation AI processor APU790, the Dimensity 9300 achieves AI edge computing processing speeds up to 8 times faster than the previous generation. In practical terms, this means it can generate image content from text in less than 1 second.

Furthermore, through MediaTek’s exclusive memory compression technology, known as NeuroPilot Compression, it significantly reduces the memory footprint of AI Large Language Models (LLMs) on end-user devices. This enables smooth operation of LLMs with up to 1 billion, 7 billion, 13 billion, and even a maximum of 33 billion parameters on terminal devices.

2. Dimensity 9300 Outperforms, but Qualcomm Remains a Strong Contender

While Dimensity 9300 exhibits superior performance in both CPU (multi-core) and GPU compared to Qualcomm’s concurrent flagship Snapdragon 8 Gen 3 SoC, a consumer survey conducted by a well-known international tech product comparison website tells a different story.

Out of 1,833 valid respondents, even after being informed about Dimensity 9300’s better benchmark results, 946 people (representing 51.6% of respondents) still chose the Qualcomm chip with lower scores.

This is likely because major smartphone manufacturers have historically favored Qualcomm over MediaTek for their flagship devices. Qualcomm has built a stronger brand image and enjoys higher recognition in the market. Therefore, MediaTek faces a formidable challenge in its quest to capture the top spot for Android high-end smartphone SoC market share with Dimensity 9300.

Furthermore, since the current benchmark results are derived from engineering samples, and the ultimate products from smartphone manufacturers have not been officially released, it remains to be seen whether Dimensity 9300 can deliver the expected performance efficiency. The final verdict on its performance will depend on the adjustments and optimizations made by these manufacturers.

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(Photo credit: MediaTek)