According to a report by Korean media outlet Business Korea, SK Hynix recently shared its latest breakthrough on its 3D DRAM at VLSI 2024 last week, announcing that the manufacturing yield of its 5-layer stacked 3D DRAM has reached 56.1%. This means that out of roughly 1,000 3D DRAM units manu...

According to a report from Nikkei citing sources, memory giant Micron Technology is building a pilot production line for advanced high-bandwidth memory (HBM) in the United States and is considering producing HBM in Malaysia for the first time to capture more demand from the AI boom. Reported on J...

Samsung and SK hynix, which have been rapidly advancing in the High-Bandwidth Memory (HBM) arena, now confirm their intention to incorporate hybrid bonding in the upcoming 3D DRAM technology, according to the latest report by The Elec. While the current technology uses micro bump to connect DRAM...

According to TrendForce's latest memory spot price trend report, neither the spot price of DRAM nor that of NAND flash shows much sign of a turnaround in the short term. It is also worth noting that the Chinese government has been cracking down on smuggling activities since the end of May, putting m...

Recently, Korean SSD controller manufacturer FADU announced a partnership with Western Digital to co-develop the next-generation enterprise SSD technology called "FDP (Flexible Data Placement)." FDP is a standard technology proposed by the Open Compute Project (OCP) and is a newly approved NVMe s...