During the "SEMICON Korea 2024" event held recently in Seoul, Chun-hwan Kim, Vice President of global memory giant SK hynix, revealed that the company's HBM3e has entered mass production, with plans to commence large-scale production of HBM4 in 2026. According to a report from Business Korea, Chu...

According to sources cited by the Financial Times, South Korean chip manufacturer SK Hynix is reportedly planning to establish a packaging facility in Indiana, USA. This move is expected to significantly advance the US government's efforts to bring more artificial intelligence (AI) chip supply cha...

Samsung's latest financial report reveals that the fourth-quarter shipments of DRAM and NAND Flash in 2023 exceeded previous expectations, reflecting an improvement in market demand. Samsung will continue selectively adjusting the production capacity of specific DRAM and NAND Flash products to boost...

From the current landscape of publicly available DRAM technologies, the industry is expected to perceive 3D DRAM as one of the solutions to the challenges faced by DRAM technology, marking it as a pivotal direction for the future memory market. Is 3D DRAM similar to 3D NAND? How will the industry...

Amid the AI trend, the significance of high-value-added DRAM represented by HBM continues to grow. HBM (High Bandwidth Memory) is a type of graphics DDR memory that boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption compared to traditional DRAM chips. ...