According to a report from Nikkei, Samsung Electronics, currently lagging behind SK hynix in the HBM market, is said to be betting on the next-generation CXL memory, with shipments expected to begin in the second half of this year, while anticipating the CXL memory to become the next rising star ...

NEO Semiconductor, a company focused on 3D DRAM and 3D NAND memory, has unveiled its latest 3D X-AI chip technology, which could potentially replace the existing HBM used in AI GPU accelerators. Reportedly, this 3D DRAM comes with built-in AI processing capabilities, enabling processing and gene...

According to TrendForce's latest memory spot price trend report, regarding DRAM spot prices, demand has yet to show improvement, leading to increased inventory pressure on suppliers, which indicates the potential for larger price drops in the future. As for NAND flash, the overall price trend is sti...

On August 13th, as per a report from Wallstreetcn citing industry sources, it's indicated that SK hynix has raised the price of its DDR5 DRAM by 15% to 20%. Per the sources, the price hike by hynix is primarily due to the production capacity being squeezed by HBM3/3e. Additionally, the increased ...

In the memory sector, the era beyond 10nm seems to be around the corner, as giants have revealed plans on the production of 1c DRAM. SK hynix, according to a report by The Elec, is said to develop a 4F2 (square) DRAM in order to reduce the high cost associated with the extreme ultraviolet (EUV) proc...