According to a report by the Central News Agency, China’s Ministry of Industry and Information Technology (MIIT) recently announced a major technological breakthrough: the development of a deep ultraviolet (DUV) lithography machine capable of producing chips at 8 nanometers and below. This technology is currently being promoted for broader application.

Despite initial market speculation that the ArF lithography machine might be suitable for 8nm processes, TrendForce’s latest market analysis suggests otherwise. The machine’s overlay accuracy of ≤ 8nm is inadequate for advanced processes, which require ≤ 3nm for 10nm processes and ≤ 2nm for 7nm processes. Additionally, for advanced processes, the resolution must be ≤ 38nm, while this machine’s resolution is ≤ 65nm, making it challenging to handle even 40nm processes.

On the 9th, the MIIT published a notice on its official website regarding the “Guiding Catalog for the Promotion and Application of Major Technical Equipment (2024 Edition),” urging local governments to enhance the coordination of national support policies across industries, finance, technology, and other sectors.

The MIIT emphasized that major technical equipment is a cornerstone of national strength and security. “China’s first (set of) major technical equipment” refers to equipment products that achieve significant technological breakthroughs domestically, hold intellectual property rights, but have not yet gained substantial market performance. This includes complete machinery, core systems, and key components.

The catalog indicates that, among the integrated circuit production equipment, one notable entry is the “ArF Lithography Machine” (DUV lithography machine). The core technical specifications are a “wafer diameter of 300mm, illumination wavelength of 248nm, resolution ≤65nm, and overlay accuracy ≤8nm.” This means that the domestically produced DUV machine is capable of manufacturing chips of 8 nanometers and below.

Reports suggest that the development of the domestic ArF lithography machine was primarily completed by several leading Chinese semiconductor equipment manufacturers and research institutions. Notably, Advanced Micro-Fabrication Equipment Inc. (AMEC) and Shanghai Micro Electronics Equipment (SMEE) were key participants. The Institute of Microelectronics of the Chinese Academy of Sciences also made significant contributions in this area.

On the 5th of this month, the United States announced tighter export controls on machines required to manufacture advanced semiconductor equipment. The Dutch government followed suit the next day, announcing expanded restrictions on semiconductor manufacturing equipment exports.

Reuters reported that ASML’s 1970i and 1980i DUV lithography machines, which are mid-range models in ASML’s DUV product line, will be impacted by these restrictions on exports to China.

According to a report by Central News Agency, if China successfully achieves domestic production of DUV lithography machines capable of 8-nanometer and below processes, most future chip manufacturing would no longer be dependent on ASML. However, as of now, there has been no official announcement from the Chinese government or manufacturers regarding this development.

Read more

• [Insights] China’s MIIT Unveils Latest Domestic DUV Equipment, Faces Challenges for 40nm Processes
• [News] Breakthrough in China’s Domestic DUV Equipment to 8nm? Experts Call It a Misunderstanding

(Photo credit: AMEC)