As applications like AIGC, 8K, AR/MR, and others continue to develop, 3D IC stacking and heterogeneous integration of chiplet have become the primary solutions to meet future high-performance computing demands and extend Moore's Law. Major companies like TSMC and Intel have been expanding their i...

According to TrendForce’s latest investigation, Chinese foundries have already suspended plans to expand production capacity for advanced processes after the US government began restricting the exportation of equipment and technical support for processes related to non-planar architectures. TrendF...

According to TrendForce, as the United States continues to expand the content of various lists, successively pass anti-China bills, and explicitly prohibit the export of certain products to China, the two countries have gradually drifted apart and this antagonistic relationship will continue if no d...

Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in transistor gate length and data transmission perfo...

TrendForce’s investigations show that, among the three categories in the upstream semiconductor supply chain, which consist of semiconductor manufacturing equipment, materials, and EDA, China made the most progress regarding self-sufficiency in semiconductor equipment, followed by materials, with ...