Eurostat released the July CPI data for the Eurozone on August 20, showing an annual growth rate of 2.6%, slightly up by 0.1% from the previous month and in line with market expectations. The three countries with the lowest annual inflation rates were Finland (0.5%), Latvia (0.8%), and Denmark (1.0%), while the highest rates were observed in Romania (5.8%), Belgium (5.4%), and Hungary (4.1%).

Among the components of the overall CPI, services inflation made the largest contribution, with an annual growth rate of 4.0%, slightly down from 4.1% in the previous month, contributing 1.82 percentage points to the overall CPI increase. This was followed by food, alcohol, and tobacco (0.45 percentage points), non-energy goods (0.19 percentage points), and energy (0.12 percentage points).

According to the European Central Bank’s (ECB) third-quarter professional forecasters’ survey, the CPI growth rate is expected to decline to 2.4% by the end of 2024, with long-term inflation projected to return to the ECB’s 2% target. Additionally, the main refinancing rate is expected to decrease to 3.75% in 2024 (currently 4.25%), with the market anticipating that the ECB will implement a 25 basis point rate cut in both September and December, and further reductions to 3.0% and 2.5% in 2025 and 2026, respectively.

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As per a report from Economic Daily News, TSMC’s first European 12-inch fab is set to hold its groundbreaking ceremony on August 20. Along with TSMC’s ongoing projects in Japan and the U.S., the investment has amounted to nearly USD 100 billion. Meanwhile, this move is also expected to generate opportunities for supporting Taiwanese contractors.

The new TSMC facility in Dresden, Germany, is anticipated to use 28/22nm planar CMOS and 16/12nm FinFET process, with a monthly production capacity of approximately 40k 12-inch wafers.

Per TSMC’s plan, its fab in Germany will start operation by the end of 2027, with estimated costs exceeding EUR 10 billion (approximately USD 10.8 billion), creating opportunities in plant equipment and engineering sectors.

In response to the demand, Marketech International, a Taiwanese fab tool maker, has already set up offices and accommodations in Dresden in 2023 and has deployed staff there.

Additionally, Topco Scientific, a Taiwanese semiconductor materials distributor, is also said to be planning to establish a presence in Europe, with plans to set up operations in Prague, Czech Republic, about two hours’ drive from Dresden.

On the other hand, TSMC is accelerating the construction of its Kumamoto plant in Japan, with production scheduled to begin by the end of this year. This facility will be the fastest among TSMC’s new overseas fabs to start production. TSMC is also actively advancing the construction of a second Kumamoto plant.

TSMC plans to invest over USD 20 billion in its two Japanese facilities, which are expected to have a combined monthly capacity of over 100k 12-inch wafers. The plants will offer 40nm, 22/28nm, 12/16nm, and 6/7nm process.

Once operational, the Kumamoto plant is anticipated to generate significant opportunities in the semiconductor inspection sector.

MA-tek, a giant in semiconductor inspection and analysis services, is planning to expand its service at its laboratories in Nagoya and Kumamoto, while setting up a third laboratory to fully meet the needs of local semiconductor clients.

As for TSMC’s fab in Arizona, U.S., the company has planned a total capital expenditure exceeding USD 65 billion. Industry sources cited by Economic Daily News have expected that companies like United Integrated Services and Marketech International will continue to benefit from this investment.

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• [News] TSMC Reports No Major Damage to Kumamoto Plant after 7.1 Magnitude Earthquake near Kyushu, Japan
• [News] TSMC’s German Plant Reported to Break Ground in Weeks, Expected to Begin Production by Late 2027

(Photo credit: TSMC)

TSMC announced last year that it would build a plant in Dresden, Germany. The plant is originally expected to break ground as early as Q4 this year, but now it may start sooner. According to a report from Deutsche Welle, TSMC’s Dresden plant will begin construction within a few weeks, which means it will start this fall, aligning with the company’s previously announced timeline.

The TSMC Germany plant was initially scheduled to begin construction in the second half of 2024 and to start production by late 2027. The new plant is expected to create approximately 2,000 direct high-tech jobs. TSMC will hold a 70% stake in the plant, with Bosch, Infineon, and NXP each holding 10% stakes, and TSMC will operate the facility. The EU and the German government are subsidizing about half of the plant’s investment.

To ensure the plant can commence production smoothly in 2027, the city of Dresden is investing EUR 250 million to build an industrial water supply system and enhance the reliability of the local power grid.

The TSMC Germany plant is expected to use 28/22nm planar CMOS and 16/12nm FinFET process technologies, with a monthly production capacity of approximately 40,000 300mm (12-inch) wafers.

On the other hand, another global semiconductor giant, Intel, was said to have delayed its construction of Fab 29.1 and 29.2 in Magdeburg, Germany, as the new timeline pushed the start of construction to May 2025, according to a report by Tom’s Hardware, citing German media outlet Volksstimme.

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• [News] TSMC Maintains Overseas Expansion Strategy, Unfazed by Geopolitical Disruptions
• [News] Intel’s 1nm-class Fabs in Germany Reportedly Delayed Due to Black Soil Concerns and Pending EU Subsidy Approval

(Photo credit: TSMC)

Recently, after reporting a loss of USD 7 billion in its manufacturing business for 2023, Intel stated that its investment in France and Italy could not be realized for the time being, which is worth several billion euros and can potentially create thousands of jobs. Relevant investment plans for chip plants mentioned above may have been suspended.

Intel noted in a statement, “Investment in France has been paused,” citing “significant changes in economic and market conditions” since 2022.

The company had selected a location southwest of Paris as a new R&D center for artificial intelligence (AI) and high-performance computing (HPC). The center is planned to open by the end of 2024 and will employ 450 people.

Intel added that the “scope” of the project is undergoing adjustment, and France remains a choice for Intel’s future R&D center.

Two years ago, Intel began negotiations with Italy on plans to invest up to EUR 4.5 billion to build a manufacturing plant in the country. This plant would create 1,500 jobs for Intel and 3,500 jobs for suppliers.

When it comes to the status of the Italian plant, Intel said it currently focused on its active manufacturing projects in Ireland, Germany, and Poland. However, Italy’s Minister of Business, Adolfo Urso, stated in March of this year that Intel had delayed its investment in Italy.

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• [News] TSMC and Intel Boost Their 2025 Capital Spending to Lead in the AI Era
• [News] New Battleground for TSMC, Samsung & Intel in Panel-Level Packaging

(Photo credit: Intel)

According to a report from Economic Daily News, amid U.S. presidential candidate Donald Trump’s remarks claiming that Taiwan is taking away chip business and should pay the U.S. for defense, geopolitical risks have become another focal point at TSMC’s July 18 earnings call.

TSMC stated that whether the tariffs may increase is a hypothetical issue; if new tariff issues do arise, TSMC will discuss with customers and share the corresponding costs. However, it is still too early to discuss this in detail. Thus, TSMC Chairman C.C. Wei emphasized that TSMC’s overseas expansion strategy remains unchanged, including ongoing fab construction in Arizona, USA, and Kumamoto, Japan, with plans for future facilities in Europe as well.

Sources cited by the report indicate that TSMC’s statement of sharing corresponding costs with customers may imply that if additional tariffs are imposed, TSMC will seek customer assistance in bearing these costs, effectively raising prices.

TSMC pointed out that in a fragmented globalization environment, the costs for everyone—including TSMC, customers, competitors, and the entire semiconductor industry—will be higher.

TSMC plans to manage and minimize cost disparities through three methods: implementing strategic pricing to reflect the value of regional flexibility; closely cooperating with local administrations to ensure their support; and leveraging fundamental advantages such as leading manufacturing technologies and large-scale production capabilities that competitors cannot match.

Regarding TSMC’s progress on overseas expansion, the Arizona plant in the USA is scheduled to begin mass production of the 4nm process in the first half of 2025 as planned. The second plant in Arizona, following recent announcements, will offer both 3nm and 2nm processes and is expected to start mass production in 2028. The third plant in Arizona is expected to provide 2nm or more advanced process technologies.

Regarding the Kumamoto plant in Japan, the target is to commence mass production in the fourth quarter of this year. Previously, TSMC and its joint venture partners announced plans to establish a second wafer plant in Japan specializing in 40nm, 12/16nm, and 6/7nm process technologies. This plant aims to support strategic customers in consumer, automotive, industrial, and high-performance computing (HPC) applications. Construction of the second wafer plant in Japan is planned to start in the second half of 2024, with production expected to begin by the end of 2027.

As for its European plant, TSMC plans to begin construction on the Dresden, Germany, facility in the fourth quarter of 2024. TSMC emphasizes that its overseas expansion depends on customer demand and government support, aiming to maximize shareholder value and ensure that its long-term gross margin target remains above 53%.

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• [News] TSMC Pushes for FOPLP Mass Production by 2027, Reportedly Eyeing on Innolux’s Plant
• [News] TSMC Reports Strong Q2 Financial Results, with 3nm Accounting for 15% of Shipments

(Photo credit: TSMC)