According to a report from TechNews, TSMC held a technology forum on May 23, where Senior Fab Director pointed out that benefiting from HPC and mobile phone demands, the 3nm production capacity this year has more than tripled compared to last year, but this is actually still not enough, so efforts are still being made to meet customer demand.

During the forum, TSMC also indicated that its compound annual growth rate (CAGR) in advanced processes below 7nm surpassed 25% from 2020 to 2024. Moreover, TSMC remains committed to investment, with capital expenditure in 2024 increasing by 10% compared to the preceding four years.

Due to the booming demand for AI and HPC, TSMC is actively expanding its capacity for advanced processes. Huang stated that TSMC’s capacity for SoIC and CoWoS is experiencing CAGRs exceeding 100% and 60%, respectively, from 2022 to 2026.

The topic of TSMC’s manufacturing has always been a focus of the industry. In the past, it was presented by Executive Vice President and Co-Chief Operating Officer Y.P. Chyn, Vice President of Fab Operations I Dr. Y.L. Wang, and TSMC Vice President of Advanced Technology and Mask Engineering Dr. T.S. Chang. This time, it is presented for the first time by the key driver of the most advanced process and plant-level executives in Taiwan.

He mentioned that the share of TSMC’s special processes in maturity has also steadily increased, from 61% in 2020 to the target of 67% in 2024.

Huang further pointed out that TSMC averaged the construction of five fabs per year  between 2022 and 2023, increasing to seven this year. Among them are three fabs, two packaging plants, and two overseas facilities.

Fab 20 in Hsinchu and Fab 22 in Kaohsiung are both 2nm fabs, progressing smoothly and expected to commence production next year.

Taichung AP5 is expanding its capacity to meet the needs for CoWoS production, while the recently announced advanced packaging investment in Chiayi is for CoWoS and SOIC production.

In terms of global deployment, three fabs are planned in Arizona, USA. The first fab is already had its first tool-in, set to commence 4nm production next year, while the second fab is scheduled for 2028 production, and the third fab is expected to begin production by the end of the 2020s. In Japan, Kumamoto Fab 1 is slated for production in the fourth quarter of this year, with Fab 2 set for production in 2027.

In Europe, the Dresden fab will offer 16nm technology, with construction beginning in the fourth quarter of this year and production slated for 2027, mainly to meet European customer needs. Additionally, Nanjing Fab 16 in China continues to expand its 28nm capacity.

When discussing the application of EUV technology, he mentioned that TSMC’s EUV machine count has grown tenfold since 2019, now accounting for 65% of the global total. Both wafer output and efficiency have significantly increased along with learning.

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• [News] TSMC’s Nanjing Plant Reportedly Pushes for Indefinite Exemption From US Before the May 31 Deadline
• [News] TSMC More Ambitious on CoWoS Capacity Expansion, Targeting 60% CAGR by 2026

(Photo credit: TSMC)

Belgium-based IMEC Microelectronics Research Center has announced the leading role in establishing the NanoIC pilot line project, for which it has received a total of EUR 2.5 billion from public and corporate donations.

As one of the four advanced semiconductor pilot line projects designated by the European Chips Joint Undertaking (Chips JU), the NanoIC pilot line is to bridge the technology gap between the lab and the fab, accelerating the development, design, and testing of proof-of-concept products through small-scale production.

According to the European Chips Act, which has a total budget of EUR 15.8 billion by 2030, the “European Chips Initiative” is regarded as a key part. This initiative aims to significantly enhance advanced chip technologies and innovation. The European Chips Initiative will gather EU, member states, and resources from the stakeholders from third-party countries related to EU programs, which is expected to be driven by the Chips Joint Undertaking (Chips JU).

In addition to spearheading the NanoIC pilot line project, IMEC will also be a part of two other projects: the advanced FD-SOI process pilot line and the advanced heterogeneous system integration pilot line. The NanoIC pilot line will focus on developing sub-2nm process SoC, providing prototype development PDK to participants from academia to industry, thereby reducing the risk of chip R&D and improving development efficiency.

Of the EUR 2.5 billion in funding, EUR 1.4 billion comes from Chips JU and the Belgian government, while the remaining EUR 1.1 billion comes from partners such as  ASML. IMEC President and CEO Luc Van den hove stated that the support from the EU, the Belgian government, and corporate partners will enable IMEC to maintain a top position and better align with market demands.

This investment will double output and learning speed, accelerate the pace of innovation, strengthen the European chip ecosystem, and hence promote economic growth in Europe.

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(Photo credit: IMEC)

On May 20, a report by Reuters revealed that Google plans to invest an additional Euro 1 billion in its data center park in Finland. This move aims to expand the scale and boost its AI business growth in Europe.

The report notes that in recent years, many data centers have been established in Nordic countries due to the cool climate, tax incentives, and ample supply of renewable energy. Finland’s wind power capacity has seen significant growth over these years, up by 75% to 5,677 megawatts by 2022, which brings electricity prices even down to negative values on particularly windy days.

Thus, Data center operators like Google have been taken advantage of this renewable energy, and already signed long-term wind power purchase agreements in Finland.

Driven by the AI wave, cloud providers such as Microsoft, Google, Meta, and Amazon have an increasingly robust demand for AI servers and data centers.

According to a previous forecast by TrendForce, considering the global CSPs’ demands for high-end AI servers (Those equipped with NVIDIA, AMD, or other high-end ASIC chips included) in 2024, the demands from four major U.S. CSPs: Microsoft, Google, AWS, and Meta are expected to account for 20.2%, 16.6%, 16%, and 10.8% of global demand respectively, reigning over the global market with a total proportion of more than 60%.

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• [Insights] Big Four CSPs Continue to Shine in Q1 2024 Financial Reports, AI Returns Garnering Attention

(Photo credit: Google)

Paul de Bot, President of TSMC Europe, confirmed during a seminar in the Netherlands on May 14th that TSMC will start construction of its first chip plant in Europe in Dresden, eastern Germany. The project is scheduled to commence in the fourth quarter of this year, with production expected to begin in 2027.

Last August, TSMC announced the joint venture factory project in Germany, with a total investment of USD 11 billion. Apart from TSMC, Infineon, NXP, and Bosch each holds a 10% stake.

According to a report from Reuters, Kevin Zhang, Senior Vice President of Business Development and Overseas Operations Office at TSMC, stated that the project has received strong support from the European Union and the German government, thus TSMC is confident in obtaining subsidies under the European Chips Act.

Kevin Zhang stated that the semiconductor ecosystem in Europe is currently exciting, indicating that setting up a foundry in Germany would allow TSMC to directly access its major automotive customers.

It is understood that TSMC’s fab in Germany will initially focus on the 22-nanometer process, mainly producing automotive microcontrollers. There is a possibility of expanding to produce more advanced chips in the future.

In addition, Intel, another semiconductor giant, had also planned a significant investment of EUR 30 billion for constructing two new fabs in Magdeburg, Eastern Germany.

TSMC’s global expansion has reached locations in China, the United States, Japan, and Germany, solidifying its goal of being a “long-term and trustworthy provider of technology and capacity.”

TSMC’s Kumamoto Plant in Japan held its opening ceremony in February, with mass production expected to begin in the fourth quarter. Kevin Zhang also emphasized that TSMC will continue to expand its operations in Japan.

In response to growing customer demand, TSMC announced in February plans to begin construction of its Kumamoto Fab 2 by the end of the year, which will be its second, more advanced fab in Japan, scheduled to start operations by the end of 2027.

In contrast, the construction progress of its Arizona plant in the United States has been relatively slow. Due to the delay in the first phase’s production timeline from the end of 2024 to the first half of 2025, the production schedule for the second phase will also be postponed to start after 2027.

Read more

• [News] Latest Overview on TSMC’s Global Expansion Initiatives
• [News] Kumamoto Vying for TSMC’s Third Fab, Looking to Build Semiconductor Hub

In 2024, trade tensions between China and the EU have intensified. On April 10th, the European Commission updated its report on distortive economic practices in China, expanding to include new industries such as telecommunications equipment, semiconductors, railways, renewable energy, and electric vehicles.

According to a report from Commercial Times, despite strong protests from China, the updated report from the European Union indicates that EU manufacturers may have filed anti-dumping complaints against Chinese chip and clean technology producers.

The Hong Kong Economic Journal (HKEJ) reported on April 11 that the latest updated version of the EU report, namely ‘COMMISSION STAFF WORKING DOCUMENT ON SIGNIFICANT DISTORTIONS IN THE ECONOMY OF THE PEOPLE’S REPUBLIC OF CHINA FOR THE PURPOSES OF TRADE DEFENCE INVESTIGATIONS‘, spans 712 pages. In addition to retaining industries like steel, aluminum, chemicals, and ceramics from the initial 2017 report, it has expanded to cover various new areas.

These include the role of the Chinese government in planning economic objectives, the importance of state-owned enterprises, special treatment in land, labor, raw materials, and energy for specific industries, and state subsidies, alleging distortive practices.

Previously, the EU’s new regulation on “Foreign Subsidies” came into effect in July 2023, followed by an announcement in October of the same year to initiate an anti-dumping investigation into Chinese electric vehicles. In response, China launched an anti-dumping investigation in January this year on distilled brandy containers of 200 liters or less originating from the EU.

Subsequently, the EU took action against Chinese company CRRC, prompting its withdrawal from public procurement tenders in Bulgaria. Recently, the EU escalated by announcing an investigation into Chinese-made wind turbines.

Despite escalating tensions in China-EU trade relations, when Chinese Minister of Commerce Wang Wentao visited Europe on April 7th, one of his main tasks was said to stabilize China-EU relations, maintain dialogue on trade disputes, and pave the way for Chinese President Xi Jinping’s planned visit to France in early May.

During Wang Wentao’s visit, he denied that Chinese automakers gain a competitive advantage through massive subsidies and emphasized that the anti-dumping investigation into EU brandy launched in January is unrelated to the electric vehicle dispute.

However, on April 10th, officials from China’s Ministry of Commerce Trade Remedy Bureau expressed a firm stance during a meeting with Lucais, Director of Trade Defence at the European Commission in Brussels. China stated that the updated report distorts China’s policies, market environment, and economic system, providing grounds for discriminatory anti-dumping measures. China expressed strong concern and opposition to this.

On the other hand, German Chancellor Olaf Scholz is set to lead a delegation to China on April 13th, with top executives from German companies such as BMW and Mercedes-Benz accompanying him.

According to a recent Reuters report, despite a nearly one-fifth decline in imports from China between 2022 and 2023, Germany maintains a high dependency on China for categories like chemicals, computers and solar cells. The “clear structural de-risking” is reportedly yet evident.

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• [News] Japan and EU Reportedly Collaborate on Advanced Materials Research to Reduce Over-Reliance
• [Insights] EV Development Faces New Challenges, Porsche CFO Suggests Delay in European Ban on New Fuel Cars

(Photo credit: Pixabay)