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Japan and the EU are reportedly set to launch formal cooperation in the research and development of advanced materials, such as chips and electric vehicle batteries. According to a report from NIKKEI, this initiative aims to decrease their high reliance on suppliers from China. Iliana Ivanova, Commissioner for Innovation and Research at the EU, revealed that the two parties will establish a collaborative framework in April.
As per the same report, Commissioner Ivanova stated during an interview that both Japan and the EU remain globally leading in advanced materials innovation. In 2020, the EU’s investment in this industry totaled EUR 19.8 billion, while Japan’s amounted to EUR 14 billion.
Under the framework tentatively named “Dialogue on Advanced Materials,” Japan and the EU plan to hold regular meetings to discuss collaboration proposals. Institutions engaged in advanced materials research from both sides will also participate. Commissioner Ivanova highlighted that the areas of cooperation include renewable energy, transportation, construction, and electronic materials. She also expressed hope for Japan and the EU to jointly develop international standards for advanced materials.
The report highlights a specific area of focus: the development of sodium-ion batteries, which are seen as the most promising next-generation power source for electric vehicles.
In recent years, the rapid growth of the global electric vehicle and energy storage markets has driven robust demand for lithium-ion batteries. As per TrendForce’s data, with further expansion expected in these sectors, the demand for lithium batteries is projected to continue growing, surpassing 3200GWh in global shipments by 2027.
Currently, China dominates the global lithium battery supply chain system, including battery metal refining, battery material processing, and battery manufacturing. Per TrendForce, more than 75% of lithium batteries worldwide are currently produced in China, making it the global leader in lithium battery manufacturing capacity.
In regard to China’s competitive advantage in the LiBs field today, it’s difficult for Japanese and South Korean companies to surpass. And it’s even more challenging for the US and Europe to catch up with China, due to the weak foundation of LiB industry locally. However, the emergence of inexhaustible and inexpensive sodium batteries may have offered a solution for the world to reduce its reliance on China.
Sodium-ion batteries do not require the use of rare metals controlled by China and have lower production costs compared to traditional batteries. The EU hopes to make progress in this area to meet the increasing demand brought about by the transition to electric vehicles.
Additionally, the EU aims to leverage Japan’s leading knowledge in metal nanoparticle technology, which can enhance solar energy conversion efficiency. Nanoparticle materials can also help smartphones save energy. In the future, the EU plans to allocate significant funding to advanced materials research, fully supporting related research and large-scale production.
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In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction costs, along with additional subsidies or incentives. Furthermore, Intel intended to establish a research and design center in France, expected to create a complete semiconductor supply chain in Europe.
However, according to a report from Reuters, Italian Minister of Industry Adolfo Urso has indicated that Intel may delay or abandon its investment plans in Italy and France to fulfill its prior commitments in Germany. Nonetheless, Italy has not completely given up on attracting Intel; Adolfo Urso emphasizes that Italy remains very welcoming if Intel changes its mind.
On the other hand, according to another previous report from Reuters, the US government is expected to announce a significant grant for Intel’s Arizona project soon. This grant will be part of the USD 39 billion direct appropriations and USD 75 billion loans and guarantees under the “Chip Act.”
Among the recipients of subsidies under the “Chip Act,” Intel is expected to receive the largest subsidy to date. According to a previous report from Tom’s Hardware, Intel is anticipated to receive a government subsidy of USD 10 billion, with TSMC and Samsung potentially included in the latest subsidy list as well.
Samsung Electronics is, according to its own expectation, investing USD 17 billion to construct a foundry in Taylor, Texas, while TSMC is investing roughly USD 40 billion to build a foundry in Phoenix, Arizona. However, there are rumors suggesting that due to the U.S. prioritizing domestic companies, the expected subsidy amounts for Intel may differ from those for TSMC and Samsung.
The U.S. government enacted the “Chip Act” in 2022, but subsidies have been modest, with only three American companies currently benefiting, including BAE Systems, GlobalFoundries, and Microchip Technology.
In order to accelerate the development of the IDM 2.0 initiative, Intel made a significant expansion decision in 2021, investing approximately USD 20 billion in the Octillo campus in Arizona, USA. This investment involved the construction of two new fabs and the implementation of EUV production lines to support Intel’s 20A and Intel’s 18A process technologies. The new Fab 52 and Fab 62 are expected to commence operations in 2024.
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(Photo credit: Intel)
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EPC SUNOTEC, a leading company of PV and energy storage station in Europe, and Huawei Technologies Bulgaria signed a memorandum of understanding on energy storage in Shenzhen to jointly promote the application of battery energy storage technology in Europe.
Huawei has accumulation of digital technology, power electronics and energy storage technologies, and SUNOTEC have comprehensive advantages in the development and construction, quality control, and project management of PV and energy storage stations. The two enterprises will carry out comprehensive cooperation in the development and application of battery energy storage technology innovation, construction and operation of large-scale energy storage power stations in Europe.
Kaloyan Velichkov, the founder and CEO of SUNOTEC, said: “We are delighted to sign this MOU with Huawei, which signifies our joint efforts to further advance our green energy initiatives. The two companies will pave the way for a zero-carbon future, promote technological innovation and promote environmental stewardship, in line with SUNOTEC’s Vision 2030. ”
Huang Hongqi, the director of Huawei’s Digital Power Global Sales Dept, said, “SUNOTEC is an important partner for us. The signing of this MOU will deepen our cooperation in the field of renewable energy, especially the large-scale application of battery energy storage systems in Europe.
Last year, we signed a cooperation agreement for a 500MW PV project with a good result. This is a milestone in the commitment of both parties to accelerate the transformation and upgrading of the energy industry and promote sustainable development for a green and beautiful future. ”
Huawei currently provides intelligent PV and energy storage projects solutions and comprehensive technical support for SUNOTEC’s PV and energy storage projects in Europe. The two parties will leverage their respective advantages to jointly contribute to Bulgaria’s green and low-carbon transformation and sustainable development.
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(Photo credit: Huawei)
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In June 2023, leading processor manufacturer Intel reached an agreement with the German federal government, announcing the signing of an amended investment memorandum. The plan involves investing over EUR 30 billion to construct two new fabs in Magdeburg. The German federal government has agreed to provide a subsidy of EUR 10 billion, including incentives and subsidies from the European Chips Act and government initiatives.
According to a report by Tom’s Hardware citing sources, Intel has submitted conceptual drawings for a new fab in Germany. The initial plans include two fabs, designated as Fab 29.1 and Fab 29.2, equipped with the world’s most advanced semiconductor tools.
Moreover, Intel reportedly has ample space for up to six additional fabs. The first batch of two fabs is expected to commence operations in the fourth quarter of 2027, with both the Intel 14A (1.4nm) and Intel 10A (1nm) advanced processes believed to be part of the plan.
As per previous reports from TechNews, Intel has not disclosed any details regarding the 10A node, but it promises at least double-digit improvements in power consumption and performance. Intel CEO Pat Gelsinger has previously stated that new processes typically improve critical dimensions by approximately 14% to 15%. Therefore, it is plausible that the 10A and 14A nodes will also experience similar improvements.
As per Intel’s roadmap, Intel 14A is also optimized in 2027, so it seems that 10A falls between 14A and 14A-E.
The report from Tom’s Hardware further indicates that Fab 29.1 and Fab 29.2, the two three-story buildings, occupy approximately 81,000 square meters, with a total length of 530 meters and a width of 153 meters. Each floor has a height ranging from 5.7 to 6.5 meters. Including the roof structure for air conditioning and heating, the building reaches a height of 36.7 meters.
The High-NA EUV exposure machines are installed on the second floor with a height of 6.5 meters, while the upper and lower floors are used for material logistics, providing necessary resources such as water, electricity, and chemicals.
ASML models that the 1st generation of the High-NA-enabled production node will employ between 4 to 9 High-NA EUV exposures and a total of 20 to 30 EUV exposures, encompassing both Low-NA and High-NA.
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(Photo credit: Intel)
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2020 was undoubtedly a milestone year in the development of TSMC, the leading semiconductor foundry. According to a report from TechNews, TSMC’s global expansion has reached locations in China, the United States, Japan, and Germany, solidifying its goal of being a “long-term and trustworthy provider of technology and capacity.”
On February 24th, TSMC will hold an opening ceremony for the Kumamoto plant, which is scheduled to commence production by the end of the year. With the opening of the Kumamoto plant, let’s review TSMC’s global expansion plan:
Arizona, United States
In May 2020, TSMC officially announced the selection of Arizona, United States, as the location for constructing an advanced process fab.
Initially planned to invest USD 12 billion, the facility aims to build a N5 process fab with a monthly capacity of 20,000 wafers. Construction was scheduled to commence in 2021, with mass production slated to begin by the end of 2024, creating approximately 1,600 job opportunities in the local area. Subsequently, in 2022, TSMC announced plans to start N4 advanced process production at the Arizona fab to meet market demands.
In December 2022, the second phase of construction began at the fab in Arizona, United States. It is expected to commence production using N3 process technology by 2026. The total investment for both phases amounts to approximately USD 40 billion, creating 4,500 jobs opportunities at TSMC.
Upon completion of both phases, the combined annual capacity will exceed 600,000 wafers, with the market value of end products estimated to exceed USD 40 billion. This project ranks as one of the largest foreign direct investment projects in US history.
However, due to the delay in the first phase’s production timeline from the end of 2024 to the first half of 2025, the production schedule for the second phase will also be postponed to start after 2027.
Kumamoto, Japan
In October 2021, TSMC, in collaboration with its customer Sony Group’s wholly-owned subsidiary, Sony Semiconductor Solutions, announced the establishment of a subsidiary called Japan Advanced Semiconductor Manufacturing (JASM) in Kumamoto, Japan. Sony Semiconductor Solutions plans to invest approximately USD 500 million to acquire up to 20% of the shares of JASM.
Following this, Denso, a major Japanese automotive components manufacturer, also announced its investment in JASM. TSMC further increased its investment in the Kumamoto plant, raising the investment amount to nearly JPY 1 trillion.
It plans to introduce 12/16-nanometer processes in addition to the originally planned 22/28-nanometer processes, with a monthly capacity reaching 55,000 wafers. This project has received commitments of support from the Japanese government, with an expected subsidy of approximately JPY 476 billion.
It was previously rumored that one of the shareholders of JASM, Sony Semiconductor, was urged by its customer, Apple, to expedite the production of image sensors (CIS) at the Kumamoto plant. Consequently, trial production began even before the opening of the Kumamoto plant. However, TSMC responded that the production timeline remains according to plan and is scheduled to commence before the end of 2024.
Recently, TSMC announced a new project in collaboration with its Japanese partners Sony Semiconductor, Denso Corporation, and Toyota Motor Corporation to invest in JASM and construct a second fab, scheduled to commence operations by the end of 2027.
TSMC stated that in response to customer demand, construction of the second JASM fab in Japan is slated to begin by the end of 2024. The expansion of production capacity is also expected to optimize the overall cost structure and supply chain efficiency of JASM.
In the future, the two fabs under JASM will enable a total monthly production capacity of over 100,000 12-inch wafers, providing 40-nanometer, 22/28-nanometer, 12/16-nanometer, and 6/7-nanometer processes for automotive, industrial, consumer, and high-performance computing (HPC) applications.
Capacity planning may be adjusted according to customer demand, with the Kumamoto plant directly creating a total of over 3,400 high-tech job opportunities. Through the investment, TSMC, Sony Semiconductor, Denso Corporation, and Toyota Motor Corporation hold approximately 86.5%, 6.0%, 5.5%, and 2.0% of the JASM shares, respectively.
Dresden, Germany
In August 2023, TSMC, along with Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., jointly announced plans to invest in the European Semiconductor Manufacturing Company (ESMC) located in Dresden, Germany, to provide advanced semiconductor manufacturing services.
TSMC stated that the ESMC represents a significant step forward in the construction of a 12-inch fab to support the future capacity demands in the rapidly growing automotive and industrial markets. The final investment decision is subject to confirmation of government subsidies.
This project is developed within the framework of the European Chips Act. Following approval by regulatory authorities and meeting other conditions, TSMC will hold a 70% stake in the joint venture, while Bosch, Infineon, and NXP will each hold a 10% stake. The fab will be operated by TSMC.
TSMC emphasized that the fab planned for this project is expected to utilize TSMC’s 28/22-nanometer Complementary Metal-Oxide-Semiconductor (CMOS) technology and 16/12-nanometer FinFET processes, with a monthly capacity of approximately 40,000 12-inch wafers.
Through advanced FinFET technology, the aim is to further strengthen the semiconductor manufacturing ecosystem in Europe and create approximately 2,000 direct high-tech job opportunities. ESMC aims to commence construction of the fab in the second half of 2024, with production slated to begin by the end of 2027.
Continuing Advancements in Advanced Processes in Taiwan
In addition to its overseas expansions, TSMC continues to advance its most cutting-edge processes and advanced packaging technologies in Taiwan.
Given the strong demand for N3 process technology over the years, TSMC is expanding the N3 process capacity at its Tainan Science Park. Additionally, in preparation for the commencement of mass production of N2 process technology in 2025, TSMC plans to establish multi-stage N2 process technology capacity in the science parks of Hsinchu and Kaohsiung.
In Hsinchu’s Baoshan area, the first phase has been completed, and TSMC’s Global R&D Center has been in use since 2023. Baoshan Phase Two will serve as the base for TSMC’s N2 process technology.
Additionally, TSMC plans to construct two 2-nanometer advanced process fabs in Kaohsiung. The related land pollution remediation projects are expected to be completed by the end of 2024.
Finally, regarding the urban planning amendment for the expansion of the Central Taiwan Science Park Phase II, which concerns TSMC’s layout for constructing 2-nanometer fabs, TSMC also indicated that the review progress by the Taichung Science Park Administration is proceeding as scheduled.
This development will allow the land in the Central Taiwan Science Park to be handed over to TSMC for use as early as 2024, enabling subsequent commencement of the construction of the fabs.
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(Photo credit: Intel)