While TSMC is making advancements on its 2nm at full throttle, an unexpected risk may be emerging, which might be more severe than most could imagine: power supply. Citing a report by S&P, a report by Wccftech highlights that compared with 2023, the foundry giant’s electricity consumption could nearly triple by 2030, accounting for about 24% of the island’s total electricity usage.

Another report by the Economic Daily News warns that the slow growth in Taiwan’s power generation may pose challenges to TSMC’s chip production, which requires high energy consumption.

Citing the data compiled by a S&P’s report titled “Power Is Increasingly A Credit Risk for TSMC,” Wccftech notes that in 2023, TSMC’s electricity consumption had reached nearly 250 GW, accounting 8% of Taiwan’s total electricity use and almost 16% of the industrial sector’s demand. However, by 2030, TSMC’s share of electricity consumption could soar significantly, contributing 23.7% of the island’s total power usage.

S&P’s calculation is based on the assumption that the TSMC’s wafer shipments will increase by 90% compared to 2023 levels, leading electricity consumption to soar to 794 GW in 2030, Wccftech notes.

It is worth noting that the S&P report, cited by Wccftech, also highlights that extreme ultraviolet (EUV) lithography systems, which are required for processes below 7nm, consume significantly more power than the older deep ultraviolet lithography systems (DUV).

The scenario would weigh heavily on semiconductor heavyweights as they are eagerly pursuing for more advanced nodes. TSMC’s move to 3nm chip production is fueling S&P’s projections of the company’s skyrocketing electricity consumption, Wccftech says.

To put things in context, the report also cites data from Taiwan’s state-owned electricity provider, TaiPower, to show that the island’s electricity reserve margin continues to fall short of the government’s 15% target. While the household electricity consumption continues to decline, TSMC’s power needs, in contrast, keeps growing.

Moreover, according to the Economic Daily News, which also cites S&P’s report, when the electricity reserve margin drops below 10%, the stability of the power supply can be affected.

Citing S&P’s report, the Economic Daily News states that the growth of Taiwan’s power supply is relatively limited. In addition, Taiwan’s policy of replacing cheaper coal and nuclear energy with natural gas and renewable energy will put more pressure on future electricity prices, which may also influence the stability of power supply.

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• [News] TSMC Took Another Step in Advanced Process Expansion

(Photo credit: TSMC)

Has the new semiconductor manufacturing equipment capable of rivaling ASML’s EUV lithography machines been shipped? Canon has announced that it will deliver its latest lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a semiconductor consortium based in Texas, according to its press release.

It is worth noting that in October, 2023, the Japanese tech giant became the first company in the world to commercialize a semiconductor manufacturing system utilizing NIL technology, which creates circuit patterns using a different approach than traditional projection exposure technology, the press release notes. Now it has officially sealed the deal with a new client.

Canon states that with reduced power consumption and cost, NIL lithography equipment enables patterning with a minimum linewidth of 14 nm, equivalent to the 5 nm node that is required to produce most advanced logic semiconductors currently available. In addition to producing 5 nm logic chips, with further improvements, it is expected to be capable of manufacturing 2 nm products as well.

Citing an interview with Kazunori Iwamoto, Deputy General Manager of Canon’s Optical Equipment Division by Nikkei, a report by MoneyDJ notes that Canon aims to sell “a dozen units each year within 3 to 5 years”.

According to Canon’s explanation, in contrast to conventional photolithography equipment, which transfers a circuit pattern by projecting it onto the resist coated wafer, the new product does it by pressing a mask imprinted with the circuit pattern into the resist on the wafer like a stamp.

Because its circuit pattern transfer process does not go through an optical mechanism, fine circuit patterns on the mask can be faithfully reproduced on the wafer.

According to MoneyDJ, Canon has been collaborating with Japan’s major mask manufacturers, Dai Nippon Printing (DNP) and Kioxia, which was still Toshiba’s subsidiary at that time, to develop NIL technology for the past decade.

Citing Canon CEO Fujio Mitarai’s previous remarks with the Japan Times in 2023, MoneyDJ notes that Canon’s NIL technology provides small semiconductor manufacturers with the opportunity to produce advanced chips that are currently dominated by large corporations, with the price probably be “one digit less” than ASML’s extreme ultraviolet (EUV) lithography systems.

According to Mitarai, the power consumption of NIL equipment is only one-tenth that of EUV machines. While NIL may be difficult to replace EUV, he believes it will create new opportunities and demand, and many customers have already expressed interest.

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• [News] Canon’s Nano-imprint Lithography Reduces Production Costs for Advanced Processes, Narrowing the Gap with ASML

(Photo credit: Canon)

According to a report by the Economic Daily News, TSMC’s first high numerical aperture extreme ultraviolet lithography (High-NA EUV) equipment will arrive this month, aiding the company in progressing its advanced process technology.

Regarding these rumors, ASML stated on September 9 that it does not comment on individual customers. TSMC has also declined to respond to market speculation.

The report has cited industry rumors, pointing out that TSMC’s first High-NA EUV machine is expected to be moved to its Global R&D Center for research purposes, addressing the development needs of future advanced processes like A14.

As for pricing, it’s reportedly rumored that TSMC President C.C. Wei personally negotiated a favorable deal, reducing the overall price by nearly 20% through a combination of purchasing the new equipment while also selling older models.

The same report further suggests that the High-NA EUV is priced at over EUR 400 million. Due to the inability to disassemble the optical lens components, the equipment is taller than a conference room and significantly longer than the previous generation. 

The report, quoting statistics, claiming that TSMC is currently the world’s largest holder of extreme ultraviolet (EUV) lithography systems, estimated to account for 65% of the global EUV wafer equipment output. It was also said to be the first manufacturer to introduce EUV equipment into the 7nm process.

ASML has already received orders for next-generation products from all of its EUV equipment customers.

Greet Storms, ASML’s Vice President of High NA EUV Product Management, recently stated that ASML is advancing new technologies and has gained the support of all EUV customers during the R&D phase.

She addressed that, these customers, who have also placed orders for High-NA equipment, are expected to move toward mass production by 2026, although the timeline will ultimately depend on customer process costs and other factors.

ASML had previously confirmed that it will deliver its latest High-NA EUV to TSMC by the end of this year. ASML emphasized that the next-generation EUV equipment began shipping at the end of last year, with a capacity to expose over 185 wafers per hour.

This will support mass production of sub-2nm logic chips and memories with similar transistor densities.

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• [News] ASML’s Second High-NA Equipment to be Installed in Intel’s Oregon Fab Soon
• [News] Price for ASML’s Hyper-NA EUV Rumored to Double, Causing TSMC, Samsung and Intel to Hesitate

(Photo credit: ASML)

In late August, it is said that the Netherlands mulls to ban ASML, the country’s semiconductor equipment giant, from conducting equipment maintenance and providing related backup components in China. Now the latest regulation has been revealed, as the Dutch government announced last Friday the expansion of export restrictions on advanced semiconductor manufacturing equipment, which covers two of ASML’s DUV immersion lithography systems, according to a report by CNBC.

The new export control rule, which took effect on September 7^th, indicates that ASML will now have to apply for licenses with the Hague rather than the US authority for some of its machines, as the Dutch government regards these curbs as a critical measure for national security, and attempts to gradually take the initiative rather than following the U.S., a report by Bloomberg notes.

According to the official announcement made by ASML, the new rule will require its TWINSCAN NXT:1970i and 1980i DUV immersion lithography systems to obtain a license from the Dutch government before being exported. The Dutch export license requirement is already in place for ASML’s TWINSCAN NXT:2000i and subsequent DUV immersion systems.

Regarding ASML’s sales in lithography units in the second quarter of 2024, China emerged as the largest market, as it contributed 49% of the revenue, higher than South Korea’s 28% and Taiwan’s 11%.

Interesting enough, ASML refers to the updated license requirement as “a technical change,” and is not expected to have any impact on the company’s financial outlook for 2024 or for its longer-term scenarios.

The latest move from the Dutch government is less harsh than the rumors earlier, which indicated that the Netherlands might ban ASML from conducting equipment maintenance and providing related backup components in China. The measure, if implemented, would be a heavy blow to China’s semiconductor industry, especially on the development of advanced nodes.

In response, China has expressed “dissatisfaction” with the Dutch government’s decision to expand export controls on ASML chipmaking equipment, according to the statement by the Chinese commerce ministry on Sunday, cited by Reuters.

The ministry urged the Dutch government not to misuse export controls, to avoid actions that could harm Sino-Dutch cooperation in the semiconductor industry, and to protect the “shared interests of Chinese and Dutch enterprises,” according to Reuters.

Beijing has consistently been criticizing Washington’s approach of pressuring allies like the Netherlands and Japan to implement export controls aimed at limiting China’s access to advanced chips and chipmaking equipment.

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• [News] ASML Claims the World Counts on China for Legacy Chips; So Do Chip Equipment Giants
• [News] ASML Might Not Be Able to Provide Advanced Chipmaking Maintenance Services to China as Early as 2025

(Photo credit: ASML)

Intel and Japan’s National Institute of Advanced Industrial Science and Technology (AIST), under the Ministry of Economy, Trade and Industry, are reportedly planning to set up an R&D hub in Japan. As per a report from Tom’s Hardware, the new facility is expected to be built within the next 3-5 years, with a total investment projected to reach hundreds of millions of dollars.

According to a report from Nikkei on September 3rd, this facility is said to be putting more focus on developing advanced semiconductor manufacturing equipment and materials, as well as introducing Extreme Ultraviolet (EUV) lithography.

On the other hand, the hub will feature EUV lithography equipment, with AIST overseeing operations and Intel providing expertise in semiconductor manufacturing using EUV equipment.

The report from Nikkei indicates that Rapidus, expected to mass-produce 2nm chips by 2027, will introduce Japan’s first EUV lithography equipment in December 2024. The planned R&D hub, per Nikkei, will become the first research institution in Japan to incorporate such tool. The hub is also considering technical collaboration and talent exchange with U.S. research institutions.

Reportedly, EUV lithography equipment is essential for producing advanced chips below 5nm, but each unit costs over JPY 40 billion, making it difficult for materials and equipment manufacturers to purchase independently.

Therefore, semicondcutor companies may have to be rely on certain research institutions’ EUV equipment overseas to conduct research and product development, such as imec.

The global semiconductor foundry leader, TSMC, established a next-generation semiconductor R&D hub in Ibaraki Prefecture, Japan, in June 2022. Additionally, Samsung Electronics plans to set up a chip R&D center in Yokohama, Japan, by the end of 2024.

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• [News] Japan’s Chip Equipment Sales Hit Record High This Year, with 23.6% YoY Growth in July
• [News] Intel Reportedly Utilizes Sharp’s LCD Panel Factory for Semiconductor Backend Process

(Photo credit: Intel)