FCBGA


2024-09-05

[News] FCBGA Sector Seems to Burgeoning with the Engagement of More Players

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology,which involves flipping the chip and connecti...

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