Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...

TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-p...

According to a report by the Commercial Times, Jin-Yang Hung, Chairman of panel manufacturing giant Innolux, expressed cautious optimism for the company’s outlook in 2024. He noted that demand and pricing for TV panels are likely to recover, while PC panels are expected to see modest growth. Howev...

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan's semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE and Powertech, alongside eq...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...