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2021-11-10
Shortage of Semiconductor Parts, Such As IC Substrates, Becomes Primary Driving Force Behind Development of FOPLP Technology
As the COVID-19 pandemic wreaked havoc on the global electronics supply chain, the packaging and testing operations of mid-range and high-end chips were subsequently confronted with prolonged lead times. This can primarily be attributed to the fact that IC substrate suppliers were unable to raise ou...
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