Amid concerns on its progress of advanced nodes, Samsung’s DS Division recorded an operating profit of 3.86 trillion won in the third quarter, marking a 40% decline from the previous quarter. Now it seems that the struggling giant plans to further scale down on foundry production, aiming to decrease operations to about 50% by year-end, according to South Korean media outlet the Chosun Daily.

The report notes that Samsung’s semiconductor division is temporarily closing down some production lines at its foundry facilities in response to weak orders from U.S. tech companies and Chinese fabless firms.

According to sources familiar with the situation cited by the report, Samsung has already closed more than 30% of its 4nm, 5nm, and 7nm production lines at Pyeongtaek Line 2 (P2) and Line 3 (P3). Furthermore, the company is said to be carefully keeping an eye on customer orders, and planning to gradually halt operations, possibly shutting down approximately 50% of its facilities by year-end.

Though the financials of its foundry business has not been disclosed separately, analysts project that the chipmaker’s foundry business suffered losses of around 1 trillion won in the third quarter, leading the company to implement cost-cutting measures by shutting down portions of its production lines, according to the report.

Instead of maintaining production lines at low utilization rates, sources cited by the report indicate that Samsung has opted to shut down operations to save on electricity costs more effectively.

The report attributes Samsung’s decision to weaker-than-anticipated orders from Chinese fabless firms, which had previously represented a significant share of Samsung’s 4nm and 5nm production volumes. U.S. trade restrictions on China’s semiconductor sector have led some Chinese fabless companies to postpone their projects ahead of the U.S. presidential election, the report indicates.

The move does raises concerns on whether the company’s technological gap with foundry leader TSMC may be widening. Lee Jong-hwan, a professor of system semiconductor engineering at Sangmyung University, observed that while Samsung seems to prioritize on memory chips, the foundry division has been sidelined, according to the report.

However, in its latest financial announcement, Samsung states that it plans to leverage the mass production on the 2 nanometer (nm) Gate-All-Around (GAA) process to win new clients. The company aims to mass produce 2nm in 2025 and 1.4nm by 2027.

Read more

• [News] Samsung’s Chip Division Sees 40% Profit Drop in Q3 as Sales Hit Record High

(Photo credit: Samsung)

Amid concerns on its HBM progress and yield issues on advanced nodes, Samsung has released its full Q3 2024 financial results, with the quarterly revenue reaching KRW 79.1 trillion won (approximately $57.35 billion), hitting an all-time high. However, its semiconductor business remains lackluster, as the DS Division recorded a quarterly operating profit of 3.86 trillion won, marking a 40% decline from the previous quarter.

According to a report by CNBC, while demand for memory chips driven by AI and traditional server products provided some support, Samsung noted that “inventory adjustments negatively impacted mobile demand.” The company also highlighted challenges with “the increasing supply of legacy products in China.”

Samsung continues to face challenges in its most advanced wafer foundry processes. According to TrendForce, the company has yet to solidify its reputation as a reliable partner for cutting-edge nodes, which may hinder its ability to secure orders from top IC design houses and potentially delay its efforts to expand capacity.

Losses in Foundry and System Chip Lead to Profit Drop in DS Division, while Memory Remains Strong

On October 31, Samsung Electronics reported Q3 consolidated revenue of KRW 79.1 trillion, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. According to Business Korea, the Q3 revenue exceeded its previous revenue record of KRW 77.78 trillion, set in Q1 2022.

However, operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division, according to its press release.

In terms of the DS Division, which encompasses the memory and foundry business, it posted KRW 29.27 trillion in consolidated revenue and KRW 3.86 trillion in operating profit in the third quarter, marking almost a 50% drop from the prior quarter’s KRW 6.45 trillion.

According the Korean Economic Daily, Samsung attributed the weaker profit to higher-than-anticipated one-time expenses totaling around KRW 1.5 trillion, which included employee performance bonuses, as well as escalating losses in its foundry and system chip divisions, each estimated at over KRW 1.5 trillion.

On the other hand, the company noted that its memory chip business performed better than anticipated, with an estimated profit of around KRW 7 trillion for the quarter, the Korean Economic Daily notes.

Memory business sales reached KRW 22.27 trillion, more than doubling from the previous year, driven by increased demand for high-end chips used in AI devices and servers, such as HBM, DDR5, and server SSDs, according to Samsung.

Key Takeaways for 2025 Outlook

In the fourth quarter, Samsung notes that while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels.

As for the Foundry Business, Samsung claims that the unit successfully met its order targets — particularly in sub-5nm technologies — and released the 2nm GAA process design kit (PDK), enabling customers to proceed with their product designs. It notes that the Foundry Business will strive to acquire customers by improving the process maturity of its 2nm GAA technology.

Looking ahead to 2025, for DRAM, Samsung plans to expand the sales of HBM3E and the portion of high-end products such as DDR5 modules with 128GB density or higher for servers and LPDDR5X for mobile, PC, servers, and so on. For NAND, it will proactively respond to the high-density trend based on QLC products — including 64TB and 128TB SSDs — and solidify leadership in the PCIe Gen5 market by accelerating the tech migration from V6 to V8.

The Foundry Business, on the other hand, aims to expand revenue through ongoing yield improvements in advanced technology while securing major customers through successful 2nm mass production. In addition, integrating advanced nodes and packaging solutions to further develop the HBM buffer die is expected to help acquire new customers in the AI and HPC sectors, according to Samsung.

(Photo credit: Samsung)

While Taiwanese foundries are reportedly facing price pressure in mature nodes and are said to be offering discounts, TSMC is also rumored to mull about offering discounts to its customers on mature nodes, particular for 7nm and 14nm, a report by Commercial Times indicates.

Sources cited by the report suggest that the foundry giant’s latest move would be a countermeasure to the competition from Samsung and other Chinese foundries.

A previous report by the Economic Daily News notes that local foundries in Taiwan, such as United Microelectronics Corp. (UMC), Vanguard International Semiconductor Corp. (VIS), and Powerchip Semiconductor Manufacturing Corp. (PSMC), are already offering discounts on mature process orders in the fourth quarter, marking a shift from the relatively stable pricing seen in the third quarter.

Now, TSMC seems to follow suit. The report by Commercial Times indicates that this move will boost capacity utilization for TSMC’s mature processes, while offsetting the risk of declining average selling prices (ASP) due to heated competition.

Looking ahead to next year, the pricing pressure on mature processes will likely persist, as TSMC may lead the way in offering discounts for some of its mature nodes, the report notes. Volume would reportedly play a key role in securing discounts, as TSMC may allow more flexibility in pricing with massive orders.

It is worth noting that Chinese foundries, which had previously been aggressive in cutting prices, have held firm this time. As these companies are struggling to make profit, they have signaled potential price increases, according to the report.

Therefore, it is indicated that certain Taiwanese IC design companies have increased their orders with local foundries. By working on price negotiations with different suppliers, they can further optimize their cost structure.

Sources in the supply chain cited by the report also indicate that in the past, Taiwanese foundries were often forced to follow their Chinese rivals in cutting prices due to aggressive competition. However, as Chinese manufacturers have been gradually balancing their supply and demand, Taiwanese companies hope to seize this opportunity by offering greater pricing flexibility this time, allowing their customers to negotiate based on the volume to expand market share and boost capacity utilization.

The other three major foundries in Taiwan, as mentioned above, had seen their utilization rates rising above 70% in the third quarter, the report suggests. However, if the foundries aim to further increase their capacity utilization, they will inevitably need to move away from the relatively passive order-taking strategies they used to adopt.

In terms of the market demand in 2025, sources from IC design firms cited by the report note that there may still be room for price adjustments. For now, the demand for advanced nodes, which are driven by AI and smartphones, seems to remain solid. However, the demand from automotive and industrial control sectors has yet to show a clear recovery, which may be inferred from the moderate price discounts offered by Taiwanese manufacturers, according to the report.

Read more

• [News] Weak Demand Drags Down Semiconductor Mature Process Pricing, May Decline for Two Quarters

(Photo credit: TSMC)

One of the most critical moves of Intel’s next step, regarded by CEO Pat Gelsinger as “the most significant transformation in over four decades,” is turning its foundry business into an independent subsidiary. Citing remarks from foreign media and analysts, a report by Taiwanese media outlet Anue notes that this is a much-needed temporary measure aimed at gaining the trust of potential customers, who may hesitate to entrust their chip designs to a competitor’s foundry division.

Following last week’s board meeting, Intel announced on September 16^th that the company will transform its foundry business into a wholly-owned subsidiary with its own board of directors.

It is worth noting that in the meantime, Intel signed a multi-billion-dollar, multi-year agreement with Amazon to produce certain chips for Amazon Web Services’ (AWS) AI data centers.

The Two tech giants will co-develop AWS’ next-gen AI fabric chips on Intel 18A, which signals a good start for Intel. Additionally, Intel is developing customized Xeon 6 server chips for AWS.

Regarding Intel’s plan on carving out its foundry business, citing comments from foreign analysts, the report by Anue states that the move could help Intel in having a better chance of attracting tech heavyweights, such as Apple, Qualcomm, Broadcom, and even AMD.

Here is why: if the new company appears as an independent entity and if it has the right board members, the foundry business could progress more smoothly, the report suggests. This move should help alleviate concerns from potential customers, but its effectiveness will yet be proven through execution.

The report added that if Intel’s collaboration with Amazon goes well, it could potentially manufacture other Amazon chips in the future, such as AWS Graviton processors and Trainium AI training chips used for machine learning.

Intel has failed to attract a significant number of clients for its foundry business, with Microsoft being its largest customer to date, the report notes.

Two years ago, the struggling giant lost the contract to design and manufacture chips for Sony’s next-generation PlayStation 6, dealing a major blow to its efforts to establish its nascent foundry business.

In its own words, the move in terms of the new subsidiary structure will provide greater separation and independence for Intel’s external foundry customers and suppliers from Intel’s other divisions. Importantly, it also gives the company the flexibility to evaluate independent funding sources in the future and optimize the capital structure of each business to maximize growth and create shareholder value.

Read more

• [News] Intel Reportedly Sought Commerce Secretary Raimondo’s Help over U.S. Reliance on TSMC
• [News] Intel to Turn Foundry Unit into Subsidiary, with Projects in Germany and Poland Delayed for 2 Years

(Photo credit: Intel)

The struggling giant seems to gradually get a turnaround, as Intel reportedly settles down plans for restructuring after the board meeting. Intel, according to a latest report by CNBC, reveals schemes to transform its foundry business into an independent unit with its own board. Moreover, the strategy will allow the foundry business to explore “independent sources of funding,” the report notes.

In a post released on September 16^th, CEO Pat Gelsinger refers to the next phase of Intel’s transformation as “the most significant transformation of Intel in over four decades. Not since the memory to microprocessor transition have we attempted something so essential.”

The plan for its foundry unit to secure outside funding would be critical, as the business has weighed heavily on Intel’s finances, with the company spending around USD 25 billion on it annually over the past two years, CNBC suggests.

It is worth noting that Intel is thinking something even bigger regarding its foundry business, as it is having the ambitious idea that in addition to possibly spinning it off, it may mull to transform the business into a separate publicly traded company, according to a source familiar with the matter cited by CNBC.

The report notes that with the establishment of an independent operating board and a streamlined corporate structure, separating the business becomes significantly easier for Intel, especially compared to the challenge of turning a fully integrated unit into a standalone company.

Along with the decision, other details of Gelsinger’s efforts have surfaced. CNBC notes that the semiconductor heavyweight would also divest a portion of its stake in Altera, according to a memo to the company’s employees.

Regarding its plan on overseas expansion, according to CNBC, citing Gelsinger’s remarks, Intel will delay its fabrication projects in Poland and Germany by roughly two years due to projected market demand. Additionally, the company will scale back its plans for its factory in Malaysia.

Intel’s decision on the delay of the two projects in Europe, partly funded through state aid, would be a heavy blow to EU, as the region tries to boost its domestic semiconductor industry to increase its resilience and independence. The EU Chips Act, in force since September 2023, aims to double Europe’s share of global semiconductor manufacturing to 20% by 2030.

According to a report by EURACTIV, Intel’s €30 billion investment in Magdeburg, Germany, is the largest project envisioned under the EU Chips Act, with one-third of the funding coming from German subsidies. In Poland, Intel’s €4.2 billion project has also been recognized as the “largest investment in Polish history,” with €1.7 billion (PLN 7.4 billion) expected to be provided through state aid.

Notably, as the company proactively pursues the support of the U.S. government, it is holding steadfast on its investments in the country. Intel’s U.S. manufacturing projects will continue as planned, according to CNBC.

Intel plans to invest USD 100 billion over the next five years in new fabs and expansions across Arizona, New Mexico, Ohio, and Oregon, creating 10,000 manufacturing jobs and 20,000 construction jobs.

The semiconductor giant’s Fab 52 and Fab 62 in Arizona are previously scheduled to be completed in 2024. However, The Register notes that the schedule may be delayed a bit, as the fabs are likely to begin operations later this year or in early 2025, targeting to manufacture chips using Intel’s next-generation Angstrom-era process technology, including the 18A node.

The company is slated to receive USD 8.5 billion in grants and USD 11 billion in loans under the 2022 Chips and Science Act, but this funding is contingent on meeting key milestones and undergoing extensive due diligence. However, an official cited by CNBC said that disbursements are anticipated by the end of the year.

(Photo credit: Intel)

Read more

• [News] Intel Reportedly Sought Commerce Secretary Raimondo’s Help over U.S. Reliance on TSMC
• [News] Uncashed Checks of the Struggling Giant: Intel’s Unfulfilled Expansion Plans in a Nutshell

(Photo credit: Intel)