According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...

As the demand for AI GPUs increases, TSMC's advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same report, TS...

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a n...