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    2024-08-05

    [News] Breaking Apple’s Monopoly – TSMC’s InFO Packaging Reportedly Adds Google Chips

    Consumer Electronics , Semiconductors

    TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...

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