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As American tech giants depart from China and relocate their production of artificial intelligence (AI) server to Mexico, according to a report from UDN, some major AI players have urged their Taiwanese manufacturing partners to enhance their investments in production in Mexico.
Reportedly, Taiwanese manufacturing giants like Foxconn and Inventec are increasingly attentive to this trend, ramping up their investments in Mexico and leveraging the advantages provided by the US-Mexico-Canada Agreement (USMCA) that came into effect in 2020.
As per a report by The Wall Street Journal, the USMCA has already attracted billions of dollars in investment in the manufacturing sector, aimed at shifting production operations from China to Mexico.
James C. F. Huang, from the Taiwan External Trade Development Council, stated that the three North American countries aim to minimize imports from Asia as much as possible. Based on this consensus, Mexico is expected to become the most significant production base within the USMCA for the production of goods.
In February, Foxconn, the world’s largest electronics manufacturing services provider, announced a USD 27 million investment in purchasing land in the western state of Jalisco, Mexico. According to the report citing sources, this move is aimed at significantly expanding the company’s production of AI servers. Foxconn stated that it has invested approximately USD 690 million in Mexico over the past four years.
Sources cited by UDN also revealed that Foxconn’s Mexican facility manufactures AI servers for American tech giants such as Amazon, Google, Microsoft, and NVIDIA. However, the US companies have declined to confirm this claim.
Last year, the chairman of Mexico’s largest private organization, Francisco Cervantes, pointed out that increased investment by Taiwanese businesses in Mexico will significantly reshape the country’s industrial structure over the next decade.
The production volume of AI server is on the rise, and American companies are hoping to avoid repeating the history of smartphones. Many core components and parts of smartphones ended up being produced in China, particularly in factories operated by companies like Foxconn, for the assembly of iPhones.
Foxconn’s Chairman Young Liu previously indicated a strong demand for AI servers, with Foxconn securing new projects continuously.
Foxconn spokesperson James Wu noted that Foxconn Group commands over 40% market share in the server industry, particularly in the mid-to-high-end products related to AI servers. Foxconn closely collaborates with customers and aims to maintain its dominance, anticipating substantial contributions once the entire supply chain stabilizes.
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(Photo credit: Foxconn)
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As generative AI applications fuel the era of high computing power, Foxconn’s connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to capitalize on the booming silicon photonics market.
According to a report from Economic Daily News, FIT and MediaTek have previously collaborated as upstream and downstream partners, with FIT being a leading manufacturer of custom ASIC sockets and having significant capacity for cooperation with upstream IC design firms.
This collaboration may mark their first joint venture in developing next-generation optical communication products, aiming to create CPO high-speed connectivity solutions using ASIC platforms and silicon photonics technology.
Foxconn Group Collaborates with MediaTek Across Industries
Industry sources cited by the report suggest that traditional data center transmission occurs on PCBs, whereas the CPO architecture is situated on the substrate, integrating optical communication components with switch into a module installed in a slot. This configuration shortens data transmission paths, reducing transmission losses and power consumption.
With the commercialization of generative AI, large language models require extensive computation within data centers, demanding high transmission rates to enhance operational efficiency. Traditional data transmission methods face significant signal loss, prolonging model training times and increasing power consumption. Consequently, the emergence of new network communication technology, CPO, addresses these challenges.
FIT asserts that CPO represents the next-generation optical communication transmission architecture, capable of shortening transmission paths, reducing transmission losses and signal delays, thereby providing more robust connectivity for AI computing and applications. It can be combined with the company’s existing optical communication products of 800G and 1.6T, forging ahead with next-generation network communication technology.
Through collaboration with MediaTek, they aim to offer customers more diverse and efficient connectivity solutions, driving the development of the era of high computational power.
MediaTek, as per the report, emphasized its commitment to adopting the industry’s most advanced processes, packaging technologies, and architectures, providing customers with diverse ASIC design platforms.
This initiative aims to offer the latest and comprehensive solutions to the rapidly growing data center and server markets. Collaborating with FIT on CPO further enhances their ability to deliver next-generation high-speed transmission solutions, thereby creating new market opportunities for customers.
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(Photo credit: Foxconn)
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Following NVIDIA’s launch of the new computing platform GB200, as per a report from Commerical Times, Taiwanese supply chain players including Quanta, Pegatron, Wiwynn, Wistron, Gigabyte, and Foxconn’s subsidiary Ingrasys have showcased their solutions and related cooling technologies based on the GB200 at the latest GTC conference, aiming to capture opportunities in the next-generation AI server market.
Quanta Cloud Technology (QCT), a subsidiary of Quanta Computer, demonstrated its systems and AI applications based on the NVIDIA MGX architecture, announcing support for the upcoming NVIDIA GB200 superchip and NVIDIA GB200 NVL72.
QCT showcased their NVIDIA MGX architecture systems, featuring the NVIDIA GH200 chip, employing a modular reference design. System manufacturers can utilize the NVIDIA MGX architecture to tailor models suitable for applications like generative AI, high-performance computing (HPC), and edge deployments.
Pegatron, on the other hand, has become one of NVIDIA’s global partners in advanced GPU computing technology, particularly with the latest NVIDIA GB200 chip. Reportedly, Pegatron is actively developing the GB200 NVL36, designed as a multi-node, liquid-cooled, rack-level platform dedicated to processing compute-intensive workloads. Equipped with the NVIDIA BlueField-3 data processing unit, it enables network acceleration in ultra-scale AI cloud environments and fulfills various GPU computing functionalities.
GIGABYTE, a key supplier of high-end AI GPU servers for NVIDIA last year, showcased their latest offerings at this year’s GTC exhibition. Their subsidiary, GIGABYTE Technology, unveiled the GIGABYTE XH23-VG0, a 2U server featuring the NVIDIA H100 GPU and GH200 architecture, capable of transferring data at speeds of up to 900GB per second. Additionally, they announced the readiness of their product line for the next-generation Blackwell platform, including HGX boards, superchips, and PCIe expansion cards, which will be released gradually over the coming months.
Meanwhile, Wiwynn, included in the first wave of suppliers for the NVIDIA GB200 NVL72 system, showcased its latest AI server cabinet solution based on the NVIDIA GB200 NVL72 at the GTC exhibition. They also presented their newest comprehensive liquid-cooled management system, the UMS100.
Ingrasys also showcased a range of innovations at the exhibition, including NVIDIA MGX architecture servers and the GB200 NVL72 solution. They also demonstrated advanced liquid cooling technologies such as the liquid-to-gas Sidecar technology and liquid-to-liquid Cooling Distribution Unit (CDU).
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(Photo credit: NVIDIA)
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As per a report from TechNews, Apple’s pivot into AI, abandoning its “Project Titan” for electric cars, signals a shift towards Generative AI. The report further cites sources indicate that Foxconn may provide AI servers to Apple and is currently in testing phase.
Regarding this matter, Foxconn responded with no comment on individual clients or products.
According to reports from Economic Daily News, Apple has conducted extensive AI feature testing and, given Foxconn’s global leadership in server manufacturing, it has emerged as Apple’s preferred partner for the AI project.
In addition to Apple, during a recent financial conference, Dell’s COO, Jeff Clarke, disclosed that NVIDIA is set to launch a new generation server GPU, “B200,” based on the Blackwell architecture in 2025. Notably, this revelation wasn’t part of NVIDIA’s product roadmap released in October 2023, and the company has not officially mentioned this product.
Currently, the H100 utilizes TSMC’s 4-nanometer process technology, with Foxconn securing approximately 90% of the assembly orders last year. While the fabrication process for the B100 and B200 chips remains unconfirmed, industry expectations cited by the report have pointed to the 3-nanometer process.
Previously, media speculation cited by the report from Commercial Times stated that although the B100 chip boasts computational power at least twice that of the H200 and four times that of the H100, still, B100’s tenure in the market is anticipated to be short-lived, with the B200 emerging as the mainstream product. It is rumored that Foxconn Industrial Internet will handle the manufacturing for the B200.
Foxconn’s Chairman Young Liu previously indicated a strong demand for AI servers, with Foxconn securing new projects continuously.
Foxconn spokesperson James Wu noted that Foxconn Group commands over 40% market share in the server industry, particularly in the mid-to-high-end products related to AI servers. Foxconn closely collaborates with customers and aims to maintain its dominance, anticipating substantial contributions once the entire supply chain stabilizes.
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(Photo credit: Foxconn)
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The battle for Apple’s iPhone manufacturing orders has entered a new phase this year. According to a report from Economic Daily News, while Foxconn still appears poised to dominate, with expectations to assemble over half of the iPhone 16 series, maintaining its lead; Luxshare, a key supplier in the supply chain, has swiftly risen to challenge, surpassing Pegatron to become the second-largest iPhone manufacturer.
With Luxshare’s share continuing to rise this year and the emergence of India’s Tata Group as a new contender, it is expected that the competition for iPhone manufacturing orders this year will be characterized by one leader, two strong contenders, and one new challenger.
In 2023, Apple launched the iPhone 15 series, with over 60% of the assembly orders handled by Foxconn, while Luxshare’s order share continued to rise, surpassing Pegatron last year to become the second-largest iPhone assembler. With Pegatron transferring the lead of its Kunshan factory in China to Luxshare at the end of last year, Luxshare’s order share is expected to continue increasing.
To retain its crucial Chinese market and further reduce costs, per a report from Economic Daily News, Apple has allowed Luxshare to continuously increase its share of Apple orders in recent years. Luxshare’s assembly products is anticipated to cover iPhone, Apple Watch, and the recently launched Vision Pro—a headset exclusively manufactured by Luxshare. Luxshare has then become a prominent supplier within the Apple supply chain in China.
The report further indicated that this year’s iPhone 16 series orders are expected to be predominantly secured by Foxconn Group, accounting for over 50% of the share. Luxshare ranks second, while Pegatron’s share is expected to decrease to third place. The proportion of Tata Group’s new device orders remains to be seen.
As Luxshare continues to expand its presence in the iPhone assembly domain, Tata Group, after taking over Wistron’s iPhone assembly plant in India, continues to improve overall production efficiency. By leveraging the advantages of being a local manufacturer in India, Luxshare’s presence in the iPhone assembly supply chain is expected to continue to rise in the future.
The report also mentioned that Tata Group is in negotiations with Pegatron to jointly establish an iPhone assembly plant in Hosur city, Tamil Nadu, in southern India. This would be marked as Tata Group’s first venture into this business through a joint venture.
Reportedly, it is suggested that Tata will hold the majority stake in the joint venture, while Pegatron will provide technical and engineering support for the Hosur city plant to help accelerate the construction process. Pegatron declined to comment on this matter.
In the past, Wistron Group’s factory in Karnataka, India, primarily produced older models of the iPhone. This factory has been sold to Tata Group. Market observers note that if the joint venture between Pegatron and Tata Group in Hosur city materializes, it will help Tata Group to expedite its entry into the production of new iPhone models.
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(Photo credit: Apple)