As Qualcomm unveiled the Snapdragon 8 Elite chipset earlier this week, Samsung, which has been working on its in-house Exynos 2500 to improve the 3nm yield, is said to abandon the plan and go Snapdragon 8 Elite only for the entire Galaxy S25 series. To turn the tide, it is reportedly embarking on the development of its next-gen Exynos chip, set to be featured in the Galaxy S27, according to Korean media outlet Sedaily and Wccftech.

The chip is expected to be manufactured with Samsung’s 2nm node, probably the SF2P process, which is an improved version of its first generation 2nm process, the reports note. Therefore, this would be a key battleground for Samsung, as it has been suffering from yield issues regarding 3nm node with GAA architecture for long.

And it does look like that Samsung aims high for the chipset, as the next-gen Exynos chip has been reportedly codenamed “Ulysses,” the Roman name for Odysseus, the hero from Greek mythology, according to Sedaily.

According to the reports, the SF2P process is slated for mass production in 2026, with enhancements in both performance and power efficiency. To be more specific, SF2P aims to improve performance by 12% while reducing power consumption by 25% and chip area by 8% compared to its predecessor.

It is also worth noting that Samsung’s foundry division is reportedly producing test chips and verifying the process design to refine the node.

Citing an industry expert, Sedaily notes that Samsung’s foundry has consistently relied on Exynos APs as a key customer. By refining its processes through managing substantial Exynos orders, Samsung has the potential to enhance its competitiveness against TSMC in next-generation chip manufacturing, although the challenge remains significant.

The challenges ahead for Samsung is formidable for sure. Foundry giant TSMC’s 2nm is expected to enter volume production in 2025, and it is already creating a buzz, as Chairman C.C. Wei said earlier that customer inquiries for 2nm are even higher than those for 3nm. According to previous market speculations, tech giants such as Apple, NVIDIA and AMD are believed to be the first batch of TSMC’s 2nm customers.

Another major rival, Intel, has shelved the 20A process node to focus entirely on the more advanced Intel 18A, aiming to enter mass production in 2025.

Japanese chip manufacturer Rapidus, on the other hand, plans to establish a fully automated production line using robots and AI in northern Japan to produce 2nm chips for advanced AI applications, with mass production anticipated as early as 2027.

Read more

• [News] Samsung’s Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure
• [News] Despite 3nm Issues, Samsung Plans to Speed up 2nm/1.4nm Expansion Next Year

(Photo credit: Samsung)

Samsung’s next-generation flagship phone, the Galaxy S25 series, is set to debut in three months. According to current market rumors, the lineup will still include the S25, S25+, and S25 Ultra models. In addition, Samsung is expected to release a “lite flagship” version, the Galaxy S25 FE. As reported by SamMobile, the S25 FE will be powered by MediaTek’s Dimensity chipset and is slated for release by the end of next year.

Prior to this report, there had been widespread speculation that MediaTek’s Dimensity 9400 would be used in the Galaxy S25 series launching early next year.

However, a recent update from SamMobile, citing @Jukanlosreve on platform X, revealed that the negotiations between Samsung and MediaTek, which initially aimed to include the Dimensity chip in the Galaxy S25, have shifted to placing the Dimensity chip in the S25 FE instead.

The latest information suggests that only the S25 FE will feature the MediaTek Dimensity chipset, while the rest of the S25 series will exclusively run on Qualcomm’s Snapdragon processors.

@Jukanlosreve did not specify the exact model of the chipset for the S25 FE, but SamMobile speculates that it will be the Dimensity 9400, MediaTek’s latest fourth-generation flagship mobile chipset, built on TSMC’s 3nm process, designed to compete with Qualcomm’s new Snapdragon 8 Elite.

(Photo credit: MediaTek)