Samsung’s next-generation flagship phone, the Galaxy S25 series, is set to debut in three months. According to current market rumors, the lineup will still include the S25, S25+, and S25 Ultra models. In addition, Samsung is expected to release a “lite flagship” version, the Galaxy S25 FE. As reported by SamMobile, the S25 FE will be powered by MediaTek’s Dimensity chipset and is slated for release by the end of next year.

Prior to this report, there had been widespread speculation that MediaTek’s Dimensity 9400 would be used in the Galaxy S25 series launching early next year.

However, a recent update from SamMobile, citing @Jukanlosreve on platform X, revealed that the negotiations between Samsung and MediaTek, which initially aimed to include the Dimensity chip in the Galaxy S25, have shifted to placing the Dimensity chip in the S25 FE instead.

The latest information suggests that only the S25 FE will feature the MediaTek Dimensity chipset, while the rest of the S25 series will exclusively run on Qualcomm’s Snapdragon processors.

@Jukanlosreve did not specify the exact model of the chipset for the S25 FE, but SamMobile speculates that it will be the Dimensity 9400, MediaTek’s latest fourth-generation flagship mobile chipset, built on TSMC’s 3nm process, designed to compete with Qualcomm’s new Snapdragon 8 Elite.

(Photo credit: MediaTek)