The U.S. government announced on February 19th that semiconductor giant GlobalFoundries (GF) will be the third company to receive approval for subsidies under the Chips and Science Act, also known as the CHIPS Act, receiving USD 1.5 billion.

According to MoneyDJ’s reports citing from Reuters, The Wall Street Journal, and other global news outlets, under a preliminary agreement with the Department of Commerce, GlobalFoundries, the world’s third-largest semiconductor foundry, will construct a new fab in Malta, New York, while expanding the production capacity of its existing production lines in Malta and Burlington, Vermont.

The Department of Commerce stated that in addition to providing a USD 1.5 billion subsidy, GlobalFoundries will also be eligible for a USD 1.6 billion loan. It is anticipated that these arrangements may generate up to USD 12.5 billion in potential investment activities across the two states.

U.S. government officials further revealed that the proposed construction project is expected to create over 10,000 job opportunities in the next decade. The chips manufactured by GlobalFoundries in the new facility will find applications not only in automotive blind spot detection, collision warning systems, Wi-Fi, and mobile communications but also in satellite technology, aerospace communications, and the defense industry.

The U.S. Department of Commerce has previously granted subsidies of USD 35 million and USD 162 million to BAE Systems, a British defense and aerospace company, and Microchip Technology Inc., a microcontroller and analog IC supplier, respectively.

The U.S. Department of Commerce chose defense contractors as the first beneficiaries of the CHIPS Act subsidies, rather than traditional chip manufacturers, highlighting the focus of the legislation on national security.

The increasing reliance on advanced chips in weapon systems has become evident. Concerns were raised during the signing of the CHIPS Act in August 2022 regarding Taiwan potentially facing military attacks, which could lead to a global shortage of advanced chips and result in the United States falling behind.

As per the company’s press release, Thomas Caulfield, President and CEO of GlobalFoundries, pointed out that the industry needs to shift its focus to the increasing demand for American-made chips and strive to cultivate more semiconductor talents in the United States.

Secretary of Commerce Gina Raimondo stated at a press conference on February 19th that this is the third subsidy issued by the US government under the Chips and Science Act, with several more subsidies expected to be approved in the coming weeks to months.

Raimondo mentioned that GlobalFoundries’ expansion project at its Malta chip plant will ensure stable chip supplies for auto suppliers and manufacturers. Additionally, the high-value chips produced at the new Malta plant are unique to the United States.

In addition, GlobalFoundries and General Motors (GM) recently announced a long-term supply agreement on February 8th, aiming to avoid a recurrence of the chip shortage crisis during the COVID-19 pandemic.

Reports have surfaced indicating that the U.S. government is considering granting Intel Corp. subsidies exceeding USD 10 billion. This would mark the largest incentive program since the inception of the CHIPS Act.

Due to market challenges and the slow pace of subsidy disbursement by the U.S. government, Intel has delayed the construction schedule of its USD 20 billion chip plant in Ohio. TSMC recently announced that the production launch of its $40 billion chip plant in Arizona will also be delayed due to ongoing subsidy negotiations with the U.S. government.

Read more

• [News] Overview of China’s Semiconductor Equipment Industry
• [News] Price War Among Chinese, Taiwanese, and Korean Foundries? Chinese Foundries Reportedly Cutting Tape Out Prices

(Photo credit: GlobalFoundries)

The latest financial reports for 4Q23 from six leading global semiconductor foundries signal optimism for the semiconductor industry’s recovery in 2024.

In 2023, the semiconductor sector underwent significant adjustments. As the industry worked towards normalizing its inventory levels amidst ongoing high inflation risks, the short-term market outlook remained unclear. #TrendForce has analyzed the latest financials from these six foundries to provide insights into what 2024 might hold for the industry.

TSMC

TSMC reported a slight YoY revenue decrease of 1.5% to US$19.62 billion in 4Q23, though it saw a 13.6% increase from the previous quarter. With an anticipated CAGR of 15–20%, TSMC’s 2024 capital expenditures are expected to be between $28 billion and $32 billion.

The company forecasts more than 10% growth in the semiconductor market (excluding memory) and around 20% growth in the wafer fabrication sector for 2024.

Samsung Electronics

Samsung Electronics’ 4Q23 consolidated revenue fell 3.81% YoY to ₩67.78 trillion. Its DS division reported revenues of ₩21.69 trillion but faced an operating loss of ₩2.18 trillion.

Despite the challenges, Samsung is focusing on advancing 3nm and 2nm GAA process technologies, expecting a revival in smartphone and PC demand in 2024 to rejuvenate the foundry market to its former prosperity.

Intel

Intel’s 4Q23 earnings saw a 10% revenue increase to $15.406 billion, with its foundry business, Intel Foundry Services, jumping 63% to $291 million in revenue.

Despite seasonal demand slumps in its core PC and server segments, Intel’s AI chips have accumulated $2 billion in orders, with sales forecast to improve in the second half of the year.

Global Foundries

GlobalFoundries reported a 12% revenue drop in 4Q23 to $1.85 billion, with a net income of $356 million. The company anticipates 1Q24 revenues to range between $1.5 billion and $1.54 billion, primarily due to the current industry-wide chip inventory adjustments.

Nevertheless, GlobalFoundries expects its 2023 automotive market revenue to surpass $1 billion, forecasting continued growth into 2024.

UMC

UMC disclosed a 19% YoY decrease in 4Q23 revenues to $1.79 billion. The company cited an extended semiconductor industry inventory adjustment period due to a challenging global economic climate, leading to a slight reduction in wafer shipments and capacity utilization. UMC expects a gradual uptick in wafer demand through 1Q24.

SMIC

SMIC reported a modest increase in 4Q23 revenues to $1.68 billion, with a 0-2% growth projection for 1Q24. Despite last year’s cyclical lows and competitive pressures, SMIC anticipates its 2024 revenue growth will at least match the industry average, with capital expenditures mirroring those of 2023.

TrendForce had earlier forecasted a delayed recovery in the end-market by the fourth quarter of 2023. However, they noted that inventory stocking by Chinese Android firms for the year-end sales rush—particularly for mid-to-low-end 5G and 4G smartphone application processors—alongside the influence of new Apple iPhone releases, might surpass initial expectations.

This indicates that the revenues of the world’s top ten semiconductor foundries are poised for growth, potentially surpassing the growth rates observed in the third quarter.

(Photo credit: Samsung)

Recent reports have suggested that UMC’s new facility in Singapore is set to be completed by mid-2024, with initial production expected to commence in early 2025.

UMC has announced that, in response to the demand for capacity expansion, the board of directors has approved a capital expenditure execution plan of USD 39.8 million. The first phase of the new facility is planned to have a monthly production capacity of 30,000 wafers, offering 22/28nm processes, with a total investment of USD 5 billion.

Semiconductor Companies Target Singapore

Influenced by complex international situations and other factors, the global semiconductor supply chain is undergoing a shift, with high expectations placed on the Southeast Asian region, particularly Singapore.

In the wafer manufacturing sector, IDM companies like Micron, Infineon, NXP Semiconductors, STMicroelectronics, and others, along with foundry enterprises like GlobalFoundries, UMC, and Vanguard International Semiconductor(VIS) are investing in building facilities in Singapore.

In 2010, GlobalFoundries acquired Singapore’s Chartered Semiconductor Manufacturing Company and took over its fab. In September 2023, GlobalFoundries announced the official launch of its USD 4 billion investment in expanding the manufacturing plant in Singapore, further expanding its global production capacity.

The expanded fab is projected to produce an additional 450,000 300mm wafers annually, raising GlobalFoundries’ total production capacity in Singapore to approximately 1.5 million 300mm wafers per year.

UMC has been operating its 12-inch fab in Singapore for over 20 years. In February 2022, UMC announced that its board of directors approved plans to expand a new advanced fab in the Fab12i campus in Singapore.

At that time, UMC anticipated that the new facility would commence production at the end of 2024. The latest updates indicate that the new facility is expected to begin production in early 2025.

VIS currently operates an 8-inch fab in Singapore. In October 2023, media reports indicated that VIS plans to establish its first 12-inch fab in Singapore. This facility is primarily intended to meet the demand for automotive chips. The investment for this project is estimated to be at least USD 2 billion, and it is anticipated to produce 28nm chips.

Continuous Expansion in Foundry Capacity

Despite the sluggish demand in the consumer electronics market, the pace of expansion for foundries remains unaffected.

Covering 2022 to 2024, the World Fab Forecast report has shown that the global semiconductor industry plans to begin operation of 82 new volume fabs, including 11 projects in 2023 and 42 projects in 2024 spanning wafer sizes ranging from 300mm to 100mm.

Among the newly added capacity, China is expected to experience rapid growth, securing the top position, followed by Taiwan, maintaining the second position. Subsequently, the rankings include South Korea, Japan, the Americas, Europe, and Southeast Asia.

According to TrendForce‘s statistics, the number of foundries in China has reached 44 and is expected to increase by 32 in the future, mainly focusing on mature nodes.

Read more

• [News] UMC, VIS, PSMC Cut Prices for Mature Process Wafers to Boost Production

(Photo credit: UMC)

Recently, the seven major foundries —TSMC, GlobalFoundries, UMC, SMIC, Hua Hong Semiconductor, VIS, and PSMC—have successively released their third-quarter financial reports and held performance briefings to explain the semiconductor industry’s business climate and the outlook for the next stage.

Overall, in the third quarter, both the revenue and net profit of the seven foundries showed a YoY decline compared to the same period last year. From the perspective of capacity utilization and foundry pricing, except for TSMC benefiting from advanced processes, seeing a rebound in capacity utilization and stable pricing, the other six all experienced declines in both data.

Recent news on foundry pricing and capacity utilization has been continuous. This article will take a closer look at the data of the above seven major foundries and the latest market dynamics to glimpse into the fourth quarter of this year and the trends in foundry services next year.

How did the seven foundries perform in Q3, and what about their capacity utilization?

TSMC

In the third quarter, TSMC’s consolidated revenue was TWD 546.73 billion, approximately USD 1.731 billion, a YoY decrease of 10.8% but a QoQ increase of 13.7%. The net profit for the third quarter was TWD 211 billion, approximately  USD 6.677 billion, a YoY decrease of 25.0%, but a QoQ increase of 16.0%. TSMC expects fourth-quarter sales to be USD 18.8~19.6 billion, with a gross profit margin of 51.5% to 53.5%.

In the first and second quarters of this year, it was said that TSMC’s 7nm capacity utilization rate had dropped to below 50%. However, in the second half of the year, benefiting from Apple expanding its new product lineup and companies like Nvidia and Qualcomm entering the 3nm era in the second half of 2024, the industry estimates that TSMC’s 7/6nm capacity utilization will hold at around 70% by the end of this year, and 5/4nm will be close to 80%, with a monthly production capacity of about 60,000~70,000 wafers by the end of this year.

GlobalFoundries

GlobalFoundries’ Q3 revenue decreased by 11% to $1.85 billion, and the net profit was USD 249 million, lower than the USD 337 million in the same period last year. GlobalFoundries CEO Thomas Caulfield stated in the financial report, “although the global economic and geopolitical landscape remains uncertain, we are collaborating closely with our customers to support their efforts to reduce inventory levels.”

UMC

UMC’s consolidated revenue for Q3 was USD 1.77 billion, a 1.37% increase compared to the second quarter but a 24.3% decrease compared to the third quarter of 2022. The gross profit margin for the third quarter was 35.9%, and the net profit was USD 495 million.

UMC’s utilization showed a significant decline during the second and third quarters, with its capacity utilization dropping from 71% in the second quarter to 67% in the third quarter, according to the company.

Looking ahead, UMC Chairman Jason Wang stated that short-term demand in the computer and communication sectors is gradually picking up in the fourth quarter, and the automotive market remains challenging. Customers continue to manage inventory levels cautiously, and the expected utilization in the fourth quarter is about 61% to 63%, with a QoQ decrease of about 5%, average selling prices remaining stable, and a gross profit margin of about 31% to 33%.

SMIC

SMIC’s Q3 revenue was USD 1.62 billion, a YoY decrease of 15.0% but a QoQ increase of 3.9%. Net profit attributable to shareholders of the parent company was CNY 678 million (approximately USD 95 million), a YoY decrease of 78.41% and a QoQ decrease of 51.81%.

In terms of production capacity, SMIC’s Q3 capacity was approximately 795,750 8-inch equivalent wafers (an increase of 41,500 8-inch equivalent wafers compared to the second quarter’s 754,250 wafers), with a capacity utilization rate of 77.1%.

Looking to the fourth quarter, SMIC expects sales revenue to increase by 1% to 3% QoQ, and the gross profit margin will continue to bear the pressure from new capacity depreciation, expected to be between 16% and 18%.

Hua Hong Semiconductor

Hua Hong’s Q3 revenue was s USD 568.5 million, a YoY decrease of 5.13% and a QoQ decrease of 8.08%. Net profit attributable to parent company was USD 95.83 million, a YoY decrease of 86.36% and a QoQ decrease of 82.40%.

Looking ahead to the fourth quarter of 2023, Hua Hong expects sales revenue to be between USD 450~500 million, with a gross profit margin of about 2% to 5%.

In terms of production capacity, as of the end of the third quarter, Hua Hong Semiconductor’s equivalent 8-inch wafer monthly production capacity increased to 358,000 wafers, with an overall capacity utilization rate of 86.8%.

VIS (Vanguard International Semiconductor)

In the third quarter, VIS’s consolidated revenue was TWD 10.557 billion, approximately USD 334 million, an increase of 7.1% QoQ.

VIS’s outlook is relatively conservative. The company expects the semiconductor supply chain to cautiously control inventory in the fourth quarter. Although the adjustment of consumer electronics inventory is nearing completion, adjustments in the automotive and industrial sectors are later. The company expects a significant adjustment in the fourth quarter, with an estimated QoQ decrease of 8% to 10% in wafer shipments, a QoQ decrease in capacity utilization in the mid-single digits, between 55% and 60%. The average selling price (ASP) of products is estimated to decrease by 2% or less per quarter, and the gross profit margin will continue to decline to between 22% and 24%.

In recent information revealed by the supply chain regarding foundry pricing, VIS might experience a pricing decline of up to 5% in the second half of the year. Big clients may even have the opportunity to negotiate a discount of up to 10%. This trend is expected to continue into the first quarter of next year, with a further reduction, possibly moving from single-digit to double-digit percentages.

PSMC

Q3 financial reports from PSMC show that, impacted by the decline in both capacity utilization and selling prices, the third-quarter main business recorded an expanded loss of TWD 1.408 billion (approximately USD 44.59 million)) and the after-tax net profit turned into a net loss of TWD 334 million(approximately USD 10 million).

PSMC General Manager Brian Shieh revealed that the market conditions in the third quarter still faced headwinds. To maintain competitiveness, PSMC has reduced prices to customers by about 4% to 5%.

It is reported that PSMC’s third-quarter capacity utilization is around 60%, and the gross profit margin is also impacted by idle capacity losses, dropping to 9.2%.

Regarding future demand, Shieh stated that the supply chain has now descended to a reasonable level, with market demand appearing in areas such as mobile driver ICs and surveillance camera CIS components. Visibility is expected to extend to around one quarter, so he is optimistic that PSMC’s fourth-quarter operations will grow by around mid-single digits.

The overall market sentiment is gradually clearing in anticipation of inventory corrections.

In general, as the fourth quarter is coming to an end, most companies still hold conservative views. In the consumer electronics field, such as PCs and smartphones, inventory adjustments have gradually reached the end, and some have already enjoyed the benefits of an upturn. However, inventory adjustments for automotive electronics and industrial applications are expected to lag, and this downturn is expected to be extended.

Among them, the views of TSMC and SMIC are worth noting. TSMC stated that customer inventory digestion will continue into the fourth quarter. Regarding the automotive and industrial platforms and AI businesses that TSMC has recently actively sought to expand, TSMC President C.C. Wei warned that the demand for AI is “not enough to offset” the weakening demand for chips in consumer electronic products on its earnings call in October.

Haijun Zhao, co-CEO of SMIC, stated that in the fields of smartphone and industrial control, Chinese customers have basically reached a balanced inventory level. However, European and American customers are still at historically high levels. Secondly, the relevant inventory of automotive products has begun to be on the high side, causing customers to be alert to market corrections, and orders are quickly tightening. Additionally, there are signs of a recovery in the third quarter in the smartphone terminal market, and the industry. As a whole, he believes that there will be a rebound in overall consumer electronics next year.

Regarding whether the global semiconductor foundry industry is slowly recovering from a downturn, TrendForce pointed out that in 2023, terminal demand is gradually recovering, and AI and automotive demand are maintaining growth momentum. AI servers are expected to grow by more than 37% in the next three years, and electric vehicles with the support of autonomous driving will have a compound annual growth rate of 30% to 40% in the next three years. Smartphones are expected to end their downward trend in 2024, with a growth rate of 2.9%, and servers will have a growth rate of 2.3%, overall leading to an increase in demand for foundry.

On the other hand, 8-inch wafer capacity utilization rate of foundries will gradually rise in 2024. The 8-inch production line produces products such as MOSFET, IGBT, and PMIC will still focus on 12-inch wafers capacity expansion in the next few years. In addition to adopting solutions from existing chip suppliers, the trend of customized chips has also emerged, and high-speed computing applications have become the biggest driving force for advanced processes. TrendForce predicts that the global foundry industry will experience a slight increase in 2024, reaching a growth rate of 6.4%.

The Silicon Photonics topic is heating up as major companies race to address the data transfer speed between chips. Intel’s Silicon Photonics project has a leading advantage, while TSMC is collaborating with major customers Nvidia and Broadcom, investing 200 research and development personnel. They aim to complete the project in the second half of 2024, with production set to begin in 2025.

According to Taiwan’s Commercial Times, Luo Huaijia, the Executive Director of the Photonics Industry and Technology Development Association (PIDA) in Taiwan, stated that silicon photonics technology has always been a crucial focus in the field of photonics. Photonics products are evolving towards being compact, lightweight, energy-efficient, and power-saving.

Among Taiwan’s semiconductor fabs, TSMC stands out with its COUPE, which provides heterogeneous integration of photonic integrated circuits (PIC) and electronic integrated circuits (EIC), reducing energy consumption by 40%. TSMC is rumored to deploy a 200-person R&D team, collaborating with international major clients for joint development. Consequently, following the completion of its Hsinchu plant, TSMC invested NT$90 billion in constructing a new packaging plant in Tongluo, Miaoli, recognizing the significant demand and potential in heterogeneous integration.

Luo Huaijia pointed out that silicon photonics uses semiconductor technology to create a platform with optical properties, with the goal of integrating light and telecommunications signals. This involves packaging traditional optical components, including optical waveguides, light-emitting elements, and transceiver modules, together, thus also involving heterogeneous packaging.

As early as 2002, Intel publicly conducted research in the field of “Silicon Photonics,” but at that time, the data volume could be handled with copper wire transmission. Luo Huaijia believes that with the exponential increase in AI computing power, data processing will start in the gigabyte range, prompting companies to invest heavily in development.

Luo Huaijia analyzed that currently, GlobalFoundries is likely the first company to provide wafer foundry services for manufacturing optical fiber transceivers, using FD-SOI technology integration solutions. Intel also currently offers a 400Gb/s optical fiber transceiver solution. In addition to their own ASICs or FPGAs, this technology is applied to Switch ICs. Intel even plans to expand its silicon photonics solution into the automotive market, using it in Mobileye’s optical radar by 2025.

Explore More

• What Is ‘Silicon Photonics’? Why Intel, TSMC, NVIDIA, Apple Are Investing
• Silicon Photonics Will Become Key to Semiconductor Future Development

(Photo credit: ITRI)