Taiwan’s semiconductor factories operate around the clock, consuming significant amounts of electricity. Taiwan Power Company has raised industrial electricity rates twice this year, and the financial impact is now starting to appear in corporate earnings.

According to Economic Daily News, TSMC Chairman C.C. Wei highlighted in the recent earnings call that Taiwan’s electricity rates have become the highest among regions with wafer fabs. TSMC warned that rising power costs and inflation could reduce its. gross margin by one percentage point. GlobalWafers, a major supplier of semiconductor wafers, also reported lower-than-expected gross margins for Q3, acknowledging energy costs as a key factor.

Wei stated that Taiwan’s electricity rates increased by 14% in October, following hikes of 15% in 2022 and 17% in 2023, with a further 25% increase anticipated in 2024. While TSMC’s third-quarter gross margin surpassed expectations at 57.8%, driven by high capacity utilization, the company projects margins could edge toward 58% this quarter. However, Wei cautioned that surging electricity costs and the costly transition from 5nm to 3nm technology are likely to dampen these gains.

The Economic Daily News report noted that GlobalWafers posted a 30% Q3 gross margin, falling short of market forecasts. Chairman Doris Hsu attributed the shortfall to four main factors: rising electricity costs worldwide, increased depreciation due to investments in multiple plants, declining silicon carbide prices, and changes in product mix, which lowered revenue and margins.

Hsu pointed out that energy is the second-largest production cost for GlobalWafers, comprising 8–9% of total expenses. At the company’s Texas facility, the unit cost of electricity is roughly one-third of Taiwan’s rate. If energy costs remain low and exchange rates are favorable, the gross margin for U.S. plants could slightly exceed that of Asian plants, excluding depreciation differences due to the longer operational history of Asian facilities.

Taiwan Power recently raised industrial rates again in October and announced a carbon fee for 2026. Hsu estimated that a carbon fee of NT$300 per ton could impact Taiwan’s production costs, reducing gross margins by 0.5 to 0.7 percentage points on a consolidated basis.

Establishing production facilities in North America offers logistics advantages by bringing production closer to clients and reducing shipping costs. Hsu explained that transporting a 300mm (12-inch) wafer from Japan to Europe currently costs ¥300, set to rise to ¥550 in November. Shipping to the U.S. would cost even more, but distribution from Texas would significantly reduce these expenses. GlobalWafers’ Texas facility is expected to complete construction by the end of 2024, with mass production slated for late Q1 2025.

TSMC’s first North American wafer fab is expected to begin production in Q1 2025, with two additional fabs set to meet customer demand by 2028 and 2030. Focused on operational efficiency, TSMC aims to leverage AI tools to boost productivity, with each 1% improvement projected to add $1 billion to profits.

(Photo credit: TSMC)

According to a report from UDN, TSMC held a groundbreaking ceremony yesterday for its Dresden, Germany plant, offering a significant boost to the EU’s efforts to stabilize its chip supply.

TSMC Chairman C.C. Wei led a team of top executives at the event, joined by key officials including German Chancellor Olaf Scholz. European Commission President Ursula von der Leyen also attended, bringing with her the announcement that the EU has approved a EUR 5 billion subsidy for the Dresden plant.

TSMC announced last August that it would partner with Bosch, Infineon, and NXP Semiconductors to establish the European Semiconductor Manufacturing Company (ESMC) in Germany.

The joint venture will construct a 12-inch wafer plant, with TSMC holding a 70% stake, while Bosch, Infineon, and NXP each hold 10%. Construction is planned to start in the second half of this year, with mass production expected by the end of 2027.

The planned fab is expected to have a monthly production capacity of 40,000 12-inch wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.  TSMC will be responsible for the plant’s operations.

Following the U.S.-China tech war, the EU passed the “Chips Act” to fully support the development of the semiconductor industry, attracting key investments from companies such as TSMC, Intel, Belgium’s IMEC, GlobalFoundries, and GlobalWafers, all of which sought subsidies for their new European operations.

TSMC’s joint venture proposal, exceeding EUR 10 billion, stands as the largest global direct investment in Saxony’s history.

When C.C. Wei took the stage, he began by thanking the German government. He revealed that when he first met with the German Chancellor, he had prepared a polite speech to decline the offer of building a plant in Germany.

However, when the Chancellor mentioned that a budget had already been reserved for TSMC, Wei eventually found himself agreeing to the project.

C.C. Wei further highlighted that TSMC’s total investment in the German plant exceeds EUR 10 billion and is expected to create around 2,000 jobs.

He explained that the decision to locate the plant in Dresden was due to its proximity to TSMC’s customers and access to a large pool of talented individuals. Wei also pledged to continue recruiting and nurturing talent in the region, with the goal of making ESMC the most important semiconductor manufacturing hub in Europe.

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(Photo credit: TSMC)

On July 17th, silicon wafer giant GlobalWafers announced that it is setting up a research and development center in Sherman, Texas, and constructing a 12-inch silicon wafer production line in St. Peters, Missouri. This move is expected to strengthen its US semiconductor supply chain. It is worth noting that the company has signed a preliminary memorandum of understanding with the US Department of Commerce and will receive a USD 400 million subsidy under the CHIPS Act.

US Secretary of Commerce Gina Raimondo noted that the US government is revitalizing the leadership position of the US semiconductor supply chain, encompassing materials, manufacturing, and R&D. GlobalWafers’ investment will enhance the US’s role in the semiconductor supply chain, provide locally sourced silicon wafers needed for advanced processes, and bolster the security of the supply chain.

GlobalWafers stated that its subsidiaries, GlobalWafers America (GWA) and MEMC, have signed a non-binding preliminary memorandum of understanding with the US Department of Commerce. Under the US CHIPS and Science Act, they will receive a USD 400 million subsidy, which is expected to be used for the construction costs of the Texas and St. Peters plants.

Upon completion, its production base in Sherman, Texas, will be the first advanced silicon wafer plant in the US with an integrated process in over 20 years.

At the Sherman, Texas production base, the initial phase of construction will create 1,200 jobs. Additionally, there will be 750 high-paying positions for production operators, technicians, and engineers in the future, with mass production expected to begin in 2026.

Once the St. Peters, Missouri plant is completed, it will be the only advanced 12-inch SOI  wafer production base in the US. It is expected to create 500 construction jobs and 130 high-paying positions.

Among the top 5 companies globally controlling over 80% of the 12-inch silicon wafer market, including GlobalWafers, 90% of these wafers are currently produced in East Asia. As per the plan, GlobalWafers’ plant in Sherman, Texas, will manufacture wafers for advanced, mature, and memory chips, while the St. Peters, Missouri plant will focus on wafers for defense and aerospace applications.

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(Photo credit: GlobalWafers)

As memory prices and demand rise, memory manufacturers Nanya Technology and Winbond have resumed normal production, no longer reducing output as they did last year. TrendForce and industry sources cited in a report from Liberty Times Net also indicate that memory shipments will continue to recover in the third quarter.

Reportedly, memory manufacturers’ utilization rates have reached 90% to 100%, surpassing the 60% to 70% utilization rates of mature process foundries.

Last year, in response to market conditions, Winbond adjusted its inventory and reduced production at its Taichung plant by up to 30-40%. This year, as market demand has rebounded, production has resumed, with capacity now at full utilization, producing 58,000 wafers per month.

Moreover, Winbond’s Kaohsiung plant has introduced new capacity equipment, increasing monthly production from 10,000 to 14,000 wafers and upgrading processes from 25nm to 20nm.

Winbond’s General Manager, Pei-Ming Chen, stated that the company is currently operating at full capacity utilization, with shipments exceeding production. This indicates a continuous decrease in inventory levels and a rise in customer demand. He then expected the second half of the year to be better than the first, with DDR3 and DDR4 contract prices increasing each quarter, aiding the company’s core profitability.

Nanya Technology Increases Production, Aims to Turn Losses into Profits in Q3

Nanya Technology adjusted production levels dynamically last year, reducing output by up to 20%. However, production has gradually increased this year.

Nanya Technology anticipates improving DRAM market conditions and prices quarter by quarter, with the industry overall trending positively and a chance to return to profitability in the third quarter.

Nanya Technology reported consolidated revenue of NTD 3.363 billion (roughly USD 103 million) for June, up 0.35% month-on-month and 36.83% year-on-year, marking the second-highest level this year. Accumulated consolidated revenue for the first half of the year was NTD 19.424 billion (roughly USD 596 million), an increase of 44.4% year-on-year.

On the other hand, chairperson Doris Hsu of GlobalWafers, a major silicon wafer manufacturer, recently stated that currently, there is stronger demand for high-performance computing (HPC) and memory applications, while demand in automotive and industrial applications is weak. Demand for mobile applications is increasing, and customers are continuing to digest inventory, leading to a more conservative approach towards procurement.

TrendForce reports that a recovery in demand for general servers—coupled with an increased production share of HBM by DRAM suppliers—has led suppliers to maintain their stance on hiking prices. As a result, the ASP of DRAM in the third quarter is expected to continue rising, with an anticipated increase of 8–13%. Among this, DDR3 & DDR4 prices expected to increase by 3–8% in Q3.

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(Photo credit: Nanya Technology)

Sources have revealed that major Chinese chip manufacturers such as SMIC (Semiconductor Manufacturing International Corporation) and CXMT (ChangXin Memory Technologies) are striving to localize the supply of critical chip materials and chemicals. This move is expected to counteract U.S. export controls and could potentially exclude global suppliers from the Chinese market.

According to a report from Nikkei News, since last year, SMIC has accelerated its efforts to require customers to help monitor, verify, and adopt local suppliers. This adoption covers a range of materials used in the chip manufacturing process, including wafers, chemicals, gasses, and other essential materials. Since being added to the U.S. entity list at the end of 2020, SMIC has been continuously exploring local supply alternatives.

Reportedly, CXMT is also actively launching a similar initiative to investigate local suppliers to replace foreign sources.

These actions indicate that China’s latest localization efforts extend beyond merely increasing the use of local chip manufacturing equipment. They now encompass hundreds of chemicals, materials, and gasses, which could potentially push foreign suppliers out of the local market.

Another source cited in a report from Nikkei news mentioned that chip manufacturers are maintaining ties with global suppliers of chip chemicals to avoid sudden impacts on production quality. However, strong incentives are stimulating the development of Chinese material suppliers. For example, National Silicon Industry Group is growing into a competitor against industry leaders like Shin-Etsu Chemical, Sumco, and GlobalWafers.

Chinese chip manufacturers are also expanding their use of local sputter targets, polishing pads, slurry, and ultra-high purity chemicals and gasses. These critical chip manufacturing materials markets have traditionally been dominated by foreign suppliers such as 3M, DuPont, and Sumitomo Chemical.

Sources cited in Nikkei’s report further indicate that these actions initially apply to less advanced chip manufacturing processes, such as 55nm and 40nm, but will eventually extend to processes below 28nm.

However, as per another report from Economic Daily News, some Taiwanese companies have indicated that the impact is limited. The areas that Chinese manufacturers can capture are mostly lower-end products, while mid-to-high-end products still heavily rely on foreign suppliers for the time being.

Taiwanese companies cited by Economic Daily News point out that China has been promoting the localization of its semiconductor supply chain for many years. While policy does provide some momentum, the key issues remain quality and yield rates. Customers are said to be reluctant to frequently adopt new suppliers, making it difficult to achieve comprehensive replacement.

Industry sources cited in the same report further note that China’s localization efforts in semiconductors are primarily focused on mature processes, with more noticeable progress in the mid-to-low-end sectors. For advanced materials like photoresists and polishing slurry, products from Japan and Western countries still hold a competitive advantage in terms of yield.

Additionally, industry sources mention that China is advancing its localization efforts more rapidly in the area of small-sized silicon wafers, which are mainly used for testing rather than production. However, for 8-inch and 12-inch silicon wafers, the market is still predominantly controlled by major foreign manufacturers.

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(Photo credit: SMIC)