According to a report from The Wall Street Journal citing sources on August 13th, it's revealed that Chinese internet companies and telecom operators have been testing Huawei's latest processor, the "Ascend 910C," in recent weeks. Reportedly, Huawei has informed potential customers that this new chi...

According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...

TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...

Apple's latest technical document reveals that the two main AI models behind Apple Intelligence are trained using Google's Tensor Processing Units (TPUs) instead of NVIDIA GPUs. According to a report from Commercial Times, this suggests that the demand for NVIDIA chips has outstripped supply, prompt...

Earlier on July 10th, in the Galaxy Unpack 2024 event in Paris, Samsung introduced its AI smartphone Galaxy Z Fold6 and Galaxy Z Flip6, along with the “Google Gemini” app installed in the models. However, according to the reports by Reuters and Business Korea, these two tech giants may be facing...