Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

Amid the AI frenzy at CES 2025, Samsung Electronics announced a lackluster fourth-quarter earnings guidance, which could be attributed to ongoing delays in obtaining NVIDIA’s approval for next-gen HBM products, according to Yonhap News and Reuters. As per Samsung’s press release, the company ...

According to a report from Central News Agency, citing Korea JoongAng Daily, South Korea's share of chip exports to China has declined, while exports to Taiwan and Vietnam have increased. This trend could be attributed to factors such as the intensifying U.S.-China chip war, rising semiconductor de...

According to a report from Liberty Times, citing Chosun Daily, Samsung Electronics is currently facing a series of challenges, including competition from China, potential U.S. tariff hikes, and a slow progress in South Korea's semiconductor policies. The report notes that Samsung must achieve sig...

Has the elephant started dancing? In addition to the reshuffle of its semiconductor executive team in November, Samsung is reportedly set to significantly revamp its supply chain for advanced semiconductor packaging, as per a report from South Korean media outlet ETNews. Notably, the move is expe...