HBM


2024-07-01

[News] Micron Targets 2026-2029 for its U.S. Fabs to Commence Operation

After Micron’s announcement of constructing two new fabs in the U.S. in 2022, the memory giant has now provided more details regarding their production timeline. According to the information the company disclosed in its Q3 FY24 financial report and its conference call, the fabs in Idaho and New Yo...

2024-06-27

[News] Samsung Reportedly to Raise Memory Price by 15-20% in Q3, Boosting Second Half Performance

According to a report from South Korean media Maeil Business Newspaper, Samsung Electronics plans to raise prices for server DRAM and enterprise NAND flash by 15% to 20% in the third quarter due to surging demand for artificial intelligence (AI). This move is expected to improve the company's perfor...

2024-06-27

[News] Memory Giant Micron’s 3Q24 Earnings Report Released, Outlook Slightly Better Than Expected

On June 26, American memory manufacturer Micron announced its financial results for the third quarter of the 2024 fiscal year (ending May 30, 2024) after the market closed: revenue increased by 82% year-over-year (17% quarter-over-quarter) to $6.811 billion; Non-GAAP diluted earnings per share (EPS)...

2024-06-27

[News] GDDR7 Emerging as a New Driver for Memory Industry

AI applications is driving the memory market forward, with HBM (High Bandwidth Memory) undoubtedly being a sought-after product of the industry, attracting increased capital expenditure and production expansion from memory manufacturers. At the meantime, a new force in the memory market has quietly ...

2024-06-26

[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron's HBM production. TC bonders play a pivotal role in HBM production...

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