HBM


2024-04-24

[News] Amid Foundry Overcapacity, Competition for HBM Intensifies Rapidly

As AI semiconductor competition intensifies, the wafer foundry industry faces new challenges due to stagnant demand and excess capacity. The battle for dominance in the high-bandwidth memory (HBM) market is also escalating. According to Business Korea, Samsung has extended the operation time of i...

2024-04-19

[News] SK Hynix Partners with TSMC to Strengthen HBM Technological Leadership

South Korean memory giant SK Hynix announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HB...

2024-04-17

[News] Memory Manufacturers’ Price Hikes Prompt Backlash, Module Suppliers Hesitate to Follow

Amid the memory market's gradual recovery, memory manufacturers are aggressively increasing prices back to pre-reduction levels and achieve profitability. According to a report from TechNews, however, module suppliers are reportedly resisting these price hikes and considering ways to negotiate with...

2024-04-15

[News] Samsung Reportedly Slows Down Without Reform, Falling Behind Competitors

According to a report from Nikkei News, under the decisive leadership of late Chairman Lee Kun-hee, South Korean company Samsung Electronics had continuously grown and expanded. However, as per the same report, with current leadership showing reluctance to take risks, Samsung has fallen behind compe...

2024-04-12

[News] Micron Expects 4-6% Quarterly DRAM Supply Impact Post Taiwan Earthquake

Memory manufacturer Micron Technology stated on April 11 that the earthquake in Taiwan on April 3 has impacted its DRAM supply, estimated to be between 4-6% (mid-single digit percentage). Micron emphasized in an 8-K filing with the U.S. Securities and Exchange Commission (SEC) that the earthquak...

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