HBM


2024-03-28

[News] Memory Manufacturers Vie for HBM3e Market

Recently, South Korean media Alphabiz reported that Samsung may exclusively supply 12-layer HBM3e to NVIDIA. The report indicates NVIDIA is set to commence large-scale purchases of Samsung Electronics' 12-layer HBM3e as early as September, who will exclusively provide the 12-layer HBM3e to NVIDIA...

2024-03-27

[News] SK Hynix Reportedly Plans to Invest USD 4 Billion in Advanced Packaging Fab in Indiana

SK Hynix is rumored planning to build an advanced packaging fab worth USD 4 billion in West Lafayette, Indiana. According to a report from The Wall Street Journal, it is expected to commence operations by 2028, creating up to 1,000 job opportunities. This initiative may receive support in the for...

2024-03-25

[News] SK Hynix Reportedly Invests Around USD 90 Billion to Commence Fab Expansion

Reportedly, South Korean memory giant SK Hynix has capitalized on the surging demand in the artificial intelligence (AI) and high-performance computing (HPC) markets. As per a report by ComputerBase, with its HBM and DDR5 products, SK Hynix has swiftly emerged from the slump in the memory market in...

2024-03-22

[News] Micron’s Financial Report Reveals High Demand for HBM in 2025, Capacity Nears Full Allocation

Micron, the major memory manufacturer in the United States, has benefited from AI demand, turning losses into profits last quarter (ending in February) and issuing optimistic financial forecasts. During its earnings call on March 20th, Micron CEO Sanjay Mehrotra stated that the company's HBM (Hig...

2024-03-22

[News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year

Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this year, aiming to surpass the...

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