The shortage of advanced packaging production capacity is anticipated to end earlier than expected. Industry suggests that Samsung’s inclusion in providing HBM3 production capacity has led to an increased supply of memory essential for advanced packaging. Coupled with TSMC's strategy of enhancing ...

Market reports suggest Nvidia's new product release cycle has shortened from two to a year, sparking intense competition among major memory companies in the realm of next-gen High Bandwidth Memory (HBM) technology. Samsung, SK Hynix, and Micron are fervently competing, with SK Hynix currently holdin...

Stepping into the fourth quarter of 2023, the memory market is witnessing a comprehensive uptick in DRAM and NAND Flash prices. This surge, attributed to the gradual impact of companies’ production cuts and sustained robust demand in specific application markets, is poised to continue into the fir...

In a subdued environment for consumer electronic applications in the storage market, High Bandwidth Memory (HBM) technology is emerging as a new driving force, gaining significant attention from major players. Recent reports reveal that both Samsung and Micron are gearing up for substantial HBM prod...

The research institution TrendForce held its AnnualForecast 2024 Seminar on November 3, where they delved into discussions about global wafer foundry trends, the applications of AI, the dynamics of AI servers, and the demand for High Bandwidth Memory (HBM). Joanne Chiao, analyst from TrendForce, ...