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HBM
In-Depth Analyses
ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC
AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...
Press Releases
AI and HPC Demand Set to Boost HBM Volume by Almost 60% in 2023, Says TrendForce
High Bandwidth Memory (HBM) is emerging as the preferred solution for overcoming memory transfer speed restrictions due to the bandwidth limitations of DDR SDRAM in high-speed computation. HBM is recognized for its revolutionary transmission efficiency and plays a pivotal role in allowing core compu...
In-Depth Analyses
HBM and 2.5D Packaging: the Essential Backbone Behind AI Server
With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...
Press Releases
HBM/CXL Emerge in Response to Demand for Optimized Hardware Used in AI-driven HPC Applications, Says TrendForce
According to TrendForce’s latest report on the server industry, not only have emerging applications in recent years accelerated the pace of AI and HPC development, but the complexity of models built from machine learning applications and inferences that involve increasingly sophisticated calculat...
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