Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...

According to a report from Korea media outlet Yonhap News Agency, South Korea's memory export to Taiwan has surged by 225% in the first half of the year. The primary driver of this increase is reportedly due to South Korean chipmaker SK hynix's supply of HBM to U.S. AI chip giant NVIDIA, which pa...

As the demand for memory chips used in AI remains strong, prompting major memory companies to accelerate their pace on HBM3e and HBM4 qualification, SK hynix CEO Kwak Noh-jung stated on August 7 that driven by the high demand for memory chips like high-bandwidth memory (HBM), the market is expected ...

SK hynix, the current High Bandwidth Memory (HBM) market leader, announced on August 6th that it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to USD 450 million in proposed direct funding and access to proposed loans of USD 500 million a...

With the chip war between the two great powers heating up, the U.S. is reportedly mulling new measures to limit China’s access to AI memory. As the restrictions might be imposed as early as late August, rumor has it that Chinese tech giants like Huawei and Baidu, along with other startups, are sto...