According to a report from Nikkei, Samsung Electronics, currently lagging behind SK hynix in the HBM market, is said to be betting on the next-generation CXL memory, with shipments expected to begin in the second half of this year, while anticipating the CXL memory to become the next rising star ...

NEO Semiconductor, a company focused on 3D DRAM and 3D NAND memory, has unveiled its latest 3D X-AI chip technology, which could potentially replace the existing HBM used in AI GPU accelerators. Reportedly, this 3D DRAM comes with built-in AI processing capabilities, enabling processing and gene...

Samsung Electronics, which has been struggling at the final stage of its HBM3e qualification with NVIDIA, may unexpectedly emerge as the pacemaker for the AI ecosystem, as the company may somehow ease the cost pressure for building AI servers by balancing the market, as well as alleviating the tight...

On August 13th, as per a report from Wallstreetcn citing industry sources, it's indicated that SK hynix has raised the price of its DDR5 DRAM by 15% to 20%. Per the sources, the price hike by hynix is primarily due to the production capacity being squeezed by HBM3/3e. Additionally, the increased ...

Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...