Samsung Electronics, which has been surround by concerns that its HBM3e products are still struggling to pass NVIDIA’s qualifications, has confirmed in its second quarter earnings call that the company’s fifth-generation 8-layer HBM3e is currently undergoing customer valuation, and is scheduled...

As SK hynix and Samsung are releasing their financial results on July 25th and July 31st, respectively, their progress on HBM3 and HBM3e have also been brought into spotlight. Earlier this week, Samsung is said to eventually passed NVIDIA’s qualification tests for its HBM3 chips. While the Big Thr...

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new "HBM Development Team" within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth mem...

According to a report from the South Korean newspaper "Korea Joongang Daily," following Micron's initiation of mass production of the latest high-bandwidth memory HBM3e in February 2024, it has recently secured an order from NVIDIA for the H200 AI GPU. It is understood that NVIDIA's upcoming H200 pr...

The shortage of advanced packaging production capacity is anticipated to end earlier than expected. Industry suggests that Samsung’s inclusion in providing HBM3 production capacity has led to an increased supply of memory essential for advanced packaging. Coupled with TSMC's strategy of enhancing ...