HBM4


2024-08-23

[News] GUC’s HBM4 IP Ready, But CSP Adoption Timing Unclear

HBM4, the sixth generation of HBM, is poised to become the key to breakthroughs in computing power for next-generation CSPs (Cloud Service Providers). According to a report from Commercial Times citing Global Unichip Corp. (GUC), to support the development of HBM4, their semiconductor IP (Intellectu...

2024-08-23

[News] HBM Technological Battle to be on the Next Level

Per a report by BusinessKorea, SK hynix Vice President Ryu Seong-su announced the company's strategic plan in the HBM field during the SK Group Icheon Forum 2024 held on August 19. SK hynix plans to develop a product that boasts dozen of times the performance of existing HBM technologies. The r...

2024-08-19

[News] Samsung Reportedly to Tape out HBM4 with 1c DRAM by Year-end

After forming a new HBM development team within its Device Solutions (DS) Division around July, memory Giant Samsung is now said to have made progress on HBM4, targeting to tape-out the product by the end of this year, a report by TheElec notes. The move is also regarded to be laying the foundation ...

2024-08-13

[News] Samsung Reportedly Confirms Investment in Pyeongtaek P4 Plant for 6th-Generation 1c DRAM

Facing increased market demand and the ongoing recovery of the memory industry, a report from Korean media outlet ETNews has reported that Samsung has confirmed its investment plan for the 6th-Generation DRAM production line at the Pyeongtaek P4 plant, with the goal of starting mass production in Ju...

2024-08-08

[News] SK hynix CEO: Demand for Memory Chips to Remain Robust until 1H25, Driven by HBM

As the demand for memory chips used in AI remains strong, prompting major memory companies to accelerate their pace on HBM3e and HBM4 qualification, SK hynix CEO Kwak Noh-jung stated on August 7 that driven by the high demand for memory chips like high-bandwidth memory (HBM), the market is expected ...

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