HBM4


2024-07-11

[News] SK hynix, TSMC, and NVIDIA Reportedly Forge Alliance to Develop Next-Generation HBM

According to a report from BusinessKorea, memory giant SK hynix is deepening its collaboration with TSMC and NVIDIA, and will announce a closer partnership at the Semicon Taiwan exhibition in September. SK hynix has been collaborating with TSMC for many years. In 2022, TSMC announced the establi...

2024-07-05

[News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new "HBM Development Team" within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth mem...

2024-06-26

[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron's HBM production. TC bonders play a pivotal role in HBM production...

2024-06-24

[News] TSMC Reportedly Secures Another AI Opportunity, Winning Order from SK Hynix

According to a report by the Economic Daily News, TSMC has secured another AI business opportunity. Following its exclusive contract manufacturing of AI chips for tech giants such as NVIDIA and AMD, TSMC, in collaboration with its subsidiary, the ASIC design service provider Global Unichip Corporati...

2024-06-17

[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant...

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