According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

NVIDIA CEO Jensen Huang delivered a keynote speech at the NTU (National Taiwan University) Sports Center on June 2. As per a report from TechNews, during the speech, he unveiled the new generation Rubin architecture, showcasing NVIDIA's accelerated rollout of new architectures, which became the high...

South Korean memory giant SK Hynix announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HB...

Samsung Electronics Co. has recently established a HBM team within its memory division, with the goal of enhancing yield during the development of the sixth-generation AI memory HBM4 and the AI accelerator Mach-1. According to a report of the Korea Economic Daily (KED) citing industry sources ...

During the "SEMICON Korea 2024" event held recently in Seoul, Chun-hwan Kim, Vice President of global memory giant SK hynix, revealed that the company's HBM3e has entered mass production, with plans to commence large-scale production of HBM4 in 2026. According to a report from Business Korea, Chu...