As the semiconductor industry continues to advance, it has sparked an arms race among Samsung, Intel, and TSMC in acquiring extreme ultraviolet (EUV) equipment. When asked about when TSMC would adopt the extremely expensive High Numerical Aperture EUV (High-NA EUV) lithography equipment, as per a re...

Semiconductor equipment giant ASML plans to launch Hyper-NA Extreme Ultraviolet (EUV) machines by 2030, signaling the advent of the Angstrom era for semiconductor processes below 1 nanometer. However, according to a report from The Chosun Daily, the high cost of this equipment may cause TSMC, Samsu...

Intel's early adoption of ASML's High Numerical Aperture Extreme Ultraviolet Lithography (High-NA EUV) equipment is seen by many as a crucial move for Intel to reclaim its technological leadership. Yet, according to a report from CNA, industry sources cited in the report have warned that the high co...

According to sources cited by a report from Economic Daily News, TSMC's A16 advanced process node might not necessarily require ASML's latest advanced chip manufacturing equipment, the High Numerical Aperture Extreme Ultraviolet Lithography (High-NA EUV), due to its expensive price. Per a report ...

TSMC announced during its briefing on the 18th that, due to robust demand in the 2-nanometer market, it plans to add another fab to the initially planned two fabs in Kaohsiung. The company intends to use the 2-nanometer process for all three fabs in Kaohsiung, in addition to the originally planne...