Source to China Times, on the 25th of this month, Huawei introduced its top-tier flagship smartphone, the Mate 60 RS. The entire supply chain is buzzing with anticipation. However, major chipset manufacturers, MediaTek and Qualcomm, both stand ready for what lies ahead. The reason for their vigilance stems from their previous share of the pie, which was snatched away by Huawei. Now, there’s concern that those gains may slowly be taken back.

For MediaTek, although Huawei’s new phone is positioned as a high-end model, it doesn’t pose a direct threat to MediaTek’s focus on mid-range and low-end 5G chips. However, industry insiders believe that Huawei might not rule out the possibility of launching mid-range and low-end 5G phone chips in the future, deepening the HarmonyOS, which could further squeeze MediaTek’s market share.

Huawei has traditionally used its in-house HiSilicon-designed chips for its smartphones. However, due to US sanctions, Huawei’s market share plummeted, allowing other Chinese smartphone competitors to seize opportunities. MediaTek and Qualcomm benefited from this shift in orders.

Recently, Huawei has made a strong comeback. Following the low-key release of the Mate 60 Pro, it has now unveiled the flagship RS model. After 3 years of intensive efforts, Huawei has achieved comprehensive self-reliance in operating systems, software, databases, and other foundational software. It has also completed the development of domestic alternatives for 13,000 components, investing heavily in the semiconductor supply chain.

The most impacted player in this scenario is Qualcomm, which primarily targets the high-end market. There are even expectations that by 2024, Qualcomm will lose all Huawei smartphone orders. Although MediaTek’s mainstream models have not been directly affected, there’s a possibility that Huawei may strengthen its HarmonyOS ecosystem, gradually penetrating the mid-range and low-end segments. MediaTek needs to remain vigilant. Huawei’s Nova series, for instance, is aimed at mid-range models, and it may not rule out using its in-house Kirin 5G chips to gain a stronger foothold in the market.

The initial stock of the Mate 60 series reached 15 million units, and the shipment target for 2023 has been raised to 20 million units, including foldable phones like the Mate X3 and X5. Supply chain sources suggest that Huawei has internally raised its overall shipment target for 2023 to 40 million units, and the market anticipates even higher volumes of 50 million to 60 million units in 2024.

Industry insiders point out that due to strong demand for Huawei’s products and better-than-expected i15 orders, there are reports of inventory replenishment in the smartphone supply chain. However, in the future, both China and the United States will cultivate their respective supply chains, reducing the win-win situations. For instance, in the RF Front-end segment, Huawei has started to use domestic supplier Maxscend Technologies, which could squeeze market orders for US and Taiwanese suppliers. (Image credit: Huawei)

(Source: https://www.chinatimes.com/newspapers/20230927000252-260204?chdtv)

On August 29, 2023, Huawei quietly launched its new smartphone, the Huawei Mate 60 Pro, on its official website without the usual fanfare associated with new product releases. Unlike previous events or those held by other brands, Huawei chose to communicate with consumers solely through a letter. What intrigued the market most was the specification of the new device’s System-on-Chip (SoC). Initially, Huawei did not provide any official information about it. However, the release of this new smartphone demonstrates China’s determination to achieve semiconductor self-sufficiency.

Key Insights from TrendForce:

• Overcoming U.S. Sanctions, Huawei Makes a Comeback

In the past, Huawei secured its position as the second-largest player in the global smartphone market by leveraging the differentiating advantage of its in-house developed Kirin SoC chips. However, since May 2019, Huawei has been affected by U.S. sanctions. In September 2020, TSMC, which previously manufactured chips for Huawei, announced the cessation of production. With no supply from TSMC, Huawei’s inventory of 5G chips was depleted by the third quarter of 2022.

Unable to acquire high-end chips, Huawei’s market share in the smartphone industry saw a significant decline. The company could only source 4G chips not subject to U.S. sanctions from Qualcomm or UNISOC. It was believed that U.S. sanctions would severely impact Huawei’s smartphone supply chain and push the company into a dire situation. However, upon analyzing Huawei’s latest release, it is evident that the new smartphone not only features an in-house developed SoC chip by Huawei’s semiconductor subsidiary HiSilicon but also incorporates components and designs from various Chinese manufacturers.

• China’s Semiconductor Self-Sufficiency Continues to Strengthen, Minimal Impact on Taiwanese Supply Chain Expected

China’s pursuit of semiconductor self-sufficiency has become an inevitable outcome of industry development. Although Huawei has not provided detailed specifications for the SoC chip in the Mate 60 Pro, it is speculated that this chip likely uses SMIC’s N+2 process. Due to sanctions, SMIC has been unable to obtain essential EUV equipment. Furthermore, based on the chip’s performance benchmarking, it is comparable to Qualcomm’s flagship Snapdragon 888 chip released in 2021. This suggests that the SoC’s process technology likely falls in the range of 7-14nm, which still lags behind current advanced processes. Nevertheless, this achievement underscores China’s commitment to semiconductor self-sufficiency.

As China gains the ability to independently develop and produce chips, the question arises of whether other Chinese smartphone brands, apart from Huawei, will begin their own chip development efforts. Will this development impact Taiwanese IC design house and foundries that previously held related orders? MediaTek, for instance, primarily supplies chips to brands such as OPPO and vivo. Given that Huawei competes strongly with OPPO and vivo in the smartphone market, it is unlikely that these two brands will entrust their smartphone core SoCs to Huawei’s HiSilicon. Additionally, developing proprietary chips comes with significant costs. Therefore, under these circumstances, it is expected that OPPO and vivo will maintain their partnerships with MediaTek. MediaTek’s chip designs can also utilize TSMC’s advanced processes, giving OPPO and vivo a key competitive advantage against Huawei. Consequently, it is inferred that as long as there is a significant gap between the processes and yields of SMIC and TSMC, Taiwanese foundries will not be significantly affected.

(Photo credit: Huawei)