On August 8, 2024, Black Sesame Technologies, a company specializing in AI chip for smart vehicles, was listed on the Hong Kong Stock Exchange.

Founded in 2016, Black Sesame is a provider of automotive-grade intelligent vehicle computing chips and chip-based solutions. The company has established research and sales centers in Wuhan, Silicon Valley, Shanghai, Chengdu, Shenzhen, Chongqing, and Singapore.

Currently, Black Sesame has launched two major product lines: the Huashan series designed for autonomous driving and the Wudang series focused on cross-domain computing.

The SoCs of Huashan A1000 family is designed for autonomous driving and supports BEV fusion algorithms for L3 and below application scenarios.

The Huashan® A1000 automotive-grade high-performance autonomous driving chip applies to L2+ and L3 level autonomous driving, which is currently the most widely used autonomous driving chip in Chinese mass-produced car companies and the only local chip platform capable of backing integrated domain controllers with a single chip.

It’s reported that Huashan A1000 chip has been in full mass production and adopted by several leading Chinese car manufacturers, including FAW Group, Dongfeng Group, Geely Group, and JAC Group, and has been used in mass-produced models including Lynk & Co 08, Hycan V09, Dongfeng eπ007, and its first pure electric SUV Dongfeng eπ008. The next-generation SoC, Huashan A2000, is currently under development and is expected to be launched in 2024.

The Wudang C1200 family of intelligent vehicle cross-domain computing chips was rolled out in April 2023. It has completed full testing after tape-out, with successful functional and performance verification, and sample chips are now available to customers.

As an “All in one” chip, the C1200 family targets multi-domain integration and cross-domain computing, covering core scenarios of intelligent vehicles with a single chip and thus empowering smart vehicles as a whole. Black Sesame expects to generate revenue from C1200 in 2024 and achieve mass production before 2025.

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(Photo credit: Black Sesame Technologies)

To jointly promote the development of Hong Kong’s microelectronics industry, Hong Kong Science and Technology Parks Corporation and MassPhoton (Hong Kong) held a launch ceremony for Hong Kong’s first ultra-high vacuum “Third-Generation Semiconductor Gallium Nitride Epitaxial Wafer Pilot Line” on July 30.

Reportedly, MassPhoton will move into the newly established Microelectronics Center (MEC) to build Hong Kong’s first 8-inch gallium nitride (GaN) epi-wafer pilot line.

According to reports from media like China News Service, MassPhoton plans to invest at least HKD 200 million in Hong Kong to establish the region’s first global R&D center for third-generation semiconductor GaN epitaxial processes in the Hong Kong Science Park. The center will develop an advanced 8-inch GaN epi-wafer process and equipment platform for the production of GaN optoelectronic and power devices.

In addition, MassPhoton will set up Hong Kong’s first ultra-high vacuum production GaN epi-wafer pilot line in the Innovation Park for small-scale production.

The pilot line is expected to be completed, followed by the construction of a GaN epi-wafer mass production line in Hong Kong, creating over 250 microelectronics-related jobs, including epi-wafer and equipment design, production process development, and more, thereby generating substantial economic value.

Currently, the global semiconductor industry is developing rapidly, simultaneously boosting the GaN market size. According to a previous TrendForce’s report, the global GaN power device market is expected to grow from USD 180 million in 2022 to USD 1.33 billion in 2026, with a compound annual growth rate (CAGR) of up to 65%.

Against this backdrop, Hong Kong has prioritized the development of third-generation semiconductor as a key technology field in recent years. For instance, in May 2024, the Finance Committee of the Hong Kong Legislative Council approved a significant investment of HKD 2.83 billion to establish the “Hong Kong Microelectronics R&D Center,” focusing on third-generation semiconductor technologies.

This plan includes setting up a pilot production line equipped with a broad range of critical tools such as I-line lithography equipment, photoresist development tools, high-temperature ion implanters, high-temperature annealing furnaces, and thin-film tools.

Sun Dong, Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region Government, introduced that the government is actively promoting the development of microelectronics industry, and the Hong Kong Microelectronics R&D Institute will be established within the year, accompanying the construction of a SiC pilot line and a GaN pilot line.

The goal is to assist startups and SMEs in trial production, testing, and certification, fostering collaboration across industry, academia, and research in core technologies of third-generation semiconductor industry.

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• [News] Foundry Giant GlobalFoundries Acquired GaN-Related IP
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(Photo credit: Hong Kong Science and Technology Parks Corporation)