Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry. Given the broader applicability of 12-inch wafer in ...

Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...

According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the yield rate for HBM2 is s...

On July 30, 2024, SK hynix announced the launch of next-generation memory product, GDDR7, with the world's highest performance. SK hynix explained that GDDR is characterized by the performance specifically designed for graphic processing and high-speed property, which has gaining an increasingly ...

In the face of adversities within the autonomous vehicle market, car manufacturers are not hitting the brakes. Rather, they’re zeroing in, adopting more focused and streamlined strategies, deeply rooted in core technologies. Eager to expedite the mass-scale rollout of Robotaxis, Tesla recently ...