HPC


2023-08-08

An In-Depth Explanation of Advanced Packaging Technology: CoWoS

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence ...

2022-10-17

[Chip War] US Department of Commerce Strengthens Restrictions on China, Future Chinese Server Demand May Face Negative Growth, Says TrendForce

Current U.S. sanctions on China have extended their reach to strike at HPC and sectors such as aerospace, automotive market, and military industry. TrendForce indicates, the market for high-end computing chips (including CPU, GPU, etc.) has borne the brunt of these restrictions at this stage, whi...

  • Page 2
  • 2 page(s)
  • 7 result(s)

Get in touch with us